Zobrazeno 1 - 10
of 76
pro vyhledávání: '"E. H. Wong"'
Autor:
Thu-Thao Le, Briana W. Y. Ang, Jennifer A. Bryant, Chee Yang Chin, Khung Keong Yeo, Philip E. H. Wong, Kay Woon Ho, Jack W. C. Tan, Phong Teck Lee, Calvin W. L. Chin, Stuart A. Cook
Publikováno v:
Journal of Cardiovascular Magnetic Resonance, Vol 23, Iss 1, Pp 1-11 (2021)
Abstract Background Stress cardiovascular magnetic resonance (CMR) offers assessment of ventricular function, myocardial perfusion and viability in a single examination to detect coronary artery disease (CAD). We developed an in-scanner exercise stre
Externí odkaz:
https://doaj.org/article/69e633b7fe2f4b3ba819c985432f39f9
Autor:
T. Peremalo, Mohd Desa Mohd Nasir, E. H. Wong, Priya Madhavan, Leslie Thian Lung Than, Pei Pei Chong, Kee Peng Ng, Siti Hawa Hamzah
Publikováno v:
Journal of Medical Microbiology. 68:346-354
Purpose. Non-albicans Candida species have emerged as fungal pathogens that cause invasive infections, with many of these species displaying resistance to commonly used antifungal agents. This study was confined to studying the characteristics of cli
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::30a3bc6a478391eeb983615ef0ebff5e
https://doi.org/10.1099/jmm.0.000940
https://doi.org/10.1099/jmm.0.000940
Autor:
E. H. Wong
Publikováno v:
Drying Technology. 35:46-54
This article presents novel techniques for characterising the kinetics of the free and bound water in a specimen by performing only one single sorption experiment. By monitoring the time-variation of the residual water in a specimen that undergoes a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ced0121e6b90ba20bd2231c5de0f7a4d
https://doi.org/10.1080/07373937.2016.1158722
https://doi.org/10.1080/07373937.2016.1158722
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this importa
Autor:
F. Farhadi, I. K. Mcrae, A. Javanmard Zadeh, Cameron A. Petrie, A. Asgari Chaverdi, A. Lashkari, Daniel T. Potts, E. H. Wong, S. Shikhi, A. Dusting
Publikováno v:
Iran. 45:287-300
In early 2007, surface survey, geophysical analysis and excavations were carried out at the site of Qaleh Kali (Tappeh Servan/Jinjun), in the Mamasani District of Fars. The excavations revealed that multiple phases of occupation are preserved at the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fb9b8b6007b99474d374d0c44a8dd77
https://doi.org/10.1080/05786967.2007.11869195
https://doi.org/10.1080/05786967.2007.11869195
Autor:
E.-H. Wong, Y.-W. Mai
Chapter 12 is dedicated to establishing the dynamic stress–strain characteristics of solder materials. The solder joints experience extensive plastic deformation during the flexural deformation of the printed circuit board assembly in the JEDEC tes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4072af47d66175754aaf0c770973f37
https://doi.org/10.1016/b978-1-84569-528-6.00012-5
https://doi.org/10.1016/b978-1-84569-528-6.00012-5
Autor:
Y.-W. Mai, E.-H. Wong
Chapter 10 analyses the dynamic response of the printed circuit board (PCB) assembly due to a board-level drop-shock, with the ultimate intention of establishing the maximum magnitude of PCB strain. The PCB was first modelled as a spring-mass system,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5beb1621c08bf5de45f47c76af7f668
https://doi.org/10.1016/b978-1-84569-528-6.00010-1
https://doi.org/10.1016/b978-1-84569-528-6.00010-1
Autor:
Y.-W. Mai, E.-H. Wong
This chapter is concerned with establishing the fatigue resistance of solder joints through a strain-life equation. Owing to the high sensitivity of solder joints to strain rate, such a relationship ought to be generated at the relevant amplitude and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53ef0072b02dcd6812306e82e349aa9c
https://doi.org/10.1016/b978-1-84569-528-6.00008-3
https://doi.org/10.1016/b978-1-84569-528-6.00008-3
Autor:
Y.-W. Mai, E.-H. Wong
Chapter 2 is dedicated to advances in the analysis of mismatched thermal expansion in microelectronic assembly and in printed circuit board (PCB) assembly. Being made of laminated structure and constituted of multiple materials, microelectronic assem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1baa0c1c969e72d34961398139dc35b8
https://doi.org/10.1016/b978-1-84569-528-6.00002-2
https://doi.org/10.1016/b978-1-84569-528-6.00002-2