Zobrazeno 1 - 1
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pro vyhledávání: '"E. H. Lenz"'
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 24:552-558
Wet chemical processes in integrated circuit (IC) manufacturing are used in many applications, e.g., post-etch residue removal and pre-deposition surface treatment. While advanced single-wafer wet spin tools are part of the critical tool-set for adva
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95bf45d4036c24ad889bc9fbdb6e70d1
https://doi.org/10.1109/tsm.2011.2162346
https://doi.org/10.1109/tsm.2011.2162346
