Zobrazeno 1 - 10
of 25
pro vyhledávání: '"E. E. Marotta"'
Autor:
E. E. Marotta, Stephen W. Miller
Publikováno v:
Journal of Thermophysics and Heat Transfer. 21:496-504
A lumped-capacitance thermal model of an avionics board within the Miniature Autonomous Extravehicular Robotic Camera was developed to predict component temperatures. Subsequently, a thermal vacuum test was conducted to determine the board's measured
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3118920ea68b6476bb11f055d68b2245
https://doi.org/10.2514/1.26659
https://doi.org/10.2514/1.26659
Publikováno v:
Journal of Thermophysics and Heat Transfer. 10:19-25
The reliability of electronic components may be improved by enhancing the thermal contact conductance at the interface of the chip and heat-spreader systems with diamond films. This investigation evaluated the effect of diamond-like films on the ther
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fecc2cbc330ab984d3cd3635e3a02b27
https://doi.org/10.2514/3.747
https://doi.org/10.2514/3.747
Autor:
Leroy S. Fletcher, E. E. Marotta
Publikováno v:
Journal of Thermophysics and Heat Transfer. 10:10-18
The reliability of high-density circuit devices may be improved by enhancing the thermal contact conductance at electronic component interfaces. Previous studies involved metallic coatings, anodized coatings, or bulk ceramic materials between electro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd08840310249402a17a609a49474e25
https://doi.org/10.2514/3.746
https://doi.org/10.2514/3.746
Autor:
Stephen W. Miller, E. E. Marotta
Publikováno v:
9th AIAA/ASME Joint Thermophysics and Heat Transfer Conference.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61ba7c1d7521eead6a5ccb1c7e71e730
https://doi.org/10.2514/6.2006-3279
https://doi.org/10.2514/6.2006-3279
Publikováno v:
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2.
IBM’s has recently introduced a high performance server that utilizes multichip modules that dissipate very high heat loads. Each multichip module consists of four microprocessor chips encased by a copper cap that serves to spread the heat load ove
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c12d873f1ec0fa6a5fcfddc4a5cd575
https://doi.org/10.1115/ipack2003-35060
https://doi.org/10.1115/ipack2003-35060
Autor:
B. Hana, E. E. Marotta
Publikováno v:
MRS Proceedings. 515
The continuous miniaturization of electronic devices places an ever-increasing importance on the thermal management of electronic systems and its subcomponents. The increased power densities and heat generation, due to the miniaturization of the devi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::afccbac6e0cc9857799500b47096e9b6
https://doi.org/10.1557/proc-515-215
https://doi.org/10.1557/proc-515-215
Publikováno v:
Proceeding of International Heat Transfer Conference 10.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e7e848f45b6d698ea5a6b023bc3dafa
https://doi.org/10.1615/ihtc10.800
https://doi.org/10.1615/ihtc10.800
Publikováno v:
31st Aerospace Sciences Meeting.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::258b92d6eb2af3c6db09b7315c162080
https://doi.org/10.2514/6.1993-845
https://doi.org/10.2514/6.1993-845
Publikováno v:
30th Aerospace Sciences Meeting and Exhibit.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e2cd226226b781d124716d718db4742
https://doi.org/10.2514/6.1992-708
https://doi.org/10.2514/6.1992-708
Publikováno v:
Journal of Thermophysics & Heat Transfer; Apr2003, Vol. 17 Issue 2, p278-282, 5p