Zobrazeno 1 - 10
of 35
pro vyhledávání: '"E. Catapano"'
Publikováno v:
IEEE Transactions on Electron Devices. 70:845-849
Autor:
L.C. Contamin, B. Cardoso Paz, B. Martinez Diaz, B. Bertrand, H. Niebojewski, V. Labracherie, A. Sadik, E. Catapano, M. Casse, E. Nowak, Y.-M. Niquet, F. Gaillard, T. Meunier, P.-A. Mortemousque, M. Vinet
Publikováno v:
2022 International Electron Devices Meeting (IEDM).
Publikováno v:
Solid-State Electronics
Solid-State Electronics, 2022, 194, pp.108319. ⟨10.1016/j.sse.2022.108319⟩
Solid-State Electronics, 2022, 194, pp.108319. ⟨10.1016/j.sse.2022.108319⟩
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f205cc13216cafe47d29eaf69481eb87
https://hal.science/hal-03974981
https://hal.science/hal-03974981
Autor:
E. Catapano, A. Aprà, M. Cassé, F. Gaillard, S. de Franceschi, T. Meunier, M. Vinet, G. Ghibaudo
Publikováno v:
Solid-State Electronics
Solid-State Electronics, 2022, 193, pp.108291. ⟨10.1016/j.sse.2022.108291⟩
Solid-State Electronics, 2022, 193, pp.108291. ⟨10.1016/j.sse.2022.108291⟩
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d320327f15c8d03d1d6aa4bd2d567cc8
https://hal.science/hal-03974993
https://hal.science/hal-03974993
Autor:
T. Mota Frutuoso, X. Garros, P. Batude, L. Brunet, J. Lacord, B. Sklenard, V. Lapras, C. Fenouillet-Beranger, M. Ribotta, A. Magalhaes-Lucas, J. Kanyandekwe, R. Kies, G. Romano, E. Catapano, M. Casse, J. Lugo-Alvarez, P. Ferrari, F. Gaillard
Publikováno v:
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022)
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), Jun 2022, Honolulu (HI), United States. ⟨10.1109/VLSITechnologyandCir46769.2022.9830504⟩
IEEELink
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), Jun 2022, Honolulu (HI), United States. ⟨10.1109/VLSITechnologyandCir46769.2022.9830504⟩
IEEELink
International audience; We present, for the first time, a new CV based technique to extract the Active Dopant Profile under the spacer in thin film FDSOI devices (CV-AJP). The methodology is successfully applied to FDSOI devices fabricated at 500°C
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9eef2750dbb3aeee813a581581b63000
https://hal.science/hal-04069091
https://hal.science/hal-04069091
Publikováno v:
Solid-State Electronics. 199:108541
Autor:
M. Vinet, T. Bedecarrats, B. Cardoso Paz, B. Martinez, E. Chanrion, E. Catapano, L. Contamin, L. Pallegoix, B. Venitucci, V. Mazzocchi, H. Niebojewski, B. Bertrand, N. Rambal, C. Thomas, J. Charbonnier, P.-A. Mortemousque, J.-M. Hartmann, E. Nowak, Y. Thonnart, G. Billiot, M. Casse, M. Urdampilleta, Y.-M. Niquet, F. Perruchot, S. De Franceschi, T. Meunier
Publikováno v:
2021 IEEE International Electron Devices Meeting (IEDM).
Publikováno v:
Solid-State Electronics. 198:108466
Autor:
S. De Franceschi, Mikael Casse, E. Catapano, Maud Vinet, F. Gaillard, A. Apra, Tristan Meunier, Gerard Ghibaudo
Publikováno v:
2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS).
FD-SOI five-gate (5G) qubit MOS devices are electrically characterized in linear regime down to deep cryogenic temperatures. The Lambert-W function is successfully used for the modelling of such 5G MOS devices from subthreshold regime to strong inver
Autor:
F. Gaillard, C. Fenouillet-Beranger, X. Garros, Joris Lacord, Jose Lugo-Alvarez, Louis Gerrer, M. Casse, Philippe Ferrari, Laurent Brunet, E. Catapano, Francois Andrieu, T. Mota Frutuoso
Publikováno v:
IRPS
The impact of interface charges under the gate spacer on FDSOI devices integrated in low temperature process are explored. A great number of traps (~1013/cm2) are identified on the interface between the spacer oxide and the silicon film using Terman'