Zobrazeno 1 - 10
of 171
pro vyhledávání: '"E R. Hsieh"'
Autor:
E. R. Hsieh, Z. Y. Wang, Y. H. Ye, Y. S. Wu, C. F. Huang, P. S. Huang, Y. S. Huang, M. L. Miu, H. S. Su, S. Y. Huang, S. M. Lu
Publikováno v:
IEEE Electron Device Letters. 43:1396-1399
Autor:
E. R. Hsieh, J. K. Chang, T. Y. Tang, Y. J. Li, C. W. Liang, M. Y. Lin, S. Y. Huang, C. J. Su, J. C. Guo, S. S. Chung
Publikováno v:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Publikováno v:
2022 IEEE Silicon Nanoelectronics Workshop (SNW).
Autor:
L. C. Lin, E R. Hsieh, T. C. Kao, M. Y. Lee, J. K. Chang, J. C. Guo, S. S. Chung, T. P. Chen, S. A. Huang, T. J. Chen, O. Cheng
Publikováno v:
2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).
Publikováno v:
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Autor:
Chung, Steve S.1 (AUTHOR) schung@nycu.edu.tw
Publikováno v:
Applied Physics A: Materials Science & Processing. Feb2023, Vol. 129 Issue 2, p1-15. 15p. 1 Black and White Photograph, 1 Illustration, 7 Diagrams, 11 Graphs.
Autor:
Jeon, Yu‐Rim1, Seo, Donguk2, Lee, Yoonmyung2, Akinwande, Deji1 deji@ece.utexas.edu, Choi, Changhwan3 cchoi@hanyang.ac.kr
Publikováno v:
Advanced Science. 8/21/2024, Vol. 11 Issue 31, p1-10. 10p.
Autor:
G. H. Ma, C. W. Yang, G. D. Lee, L. W. Cheng, C. T. Tsai, W. M. Lin, Steve S. Chung, Y. S. Hsieh, Y. H. Chu, E. R. Hsieh
Publikováno v:
Extended Abstracts of the 2009 International Conference on Solid State Devices and Materials.
Autor:
Hsieh, E. R., Wang, Z. Y., Ye, Y. H., Wu, Y. S., Huang, C. F., Huang, P. S., Huang, Y. S., Miu, M. L., Su, H. S., Huang, S. Y., Lu, S. M.
Publikováno v:
IEEE Electron Device Letters; Sep2022, Vol. 43 Issue 9, p1396-1399, 4p
Autor:
Kumar, Dayanand1 (AUTHOR), Li, Hanrui1 (AUTHOR), Kumbhar, Dhananjay D.1 (AUTHOR), Rajbhar, Manoj Kumar1 (AUTHOR), Das, Uttam Kumar1 (AUTHOR), Syed, Abdul Momin1 (AUTHOR), Melinte, Georgian1 (AUTHOR), El-Atab, Nazek1 (AUTHOR) nazek.elatab@kaust.edu.sa
Publikováno v:
Nano-Micro Letters. 7/8/2024, Vol. 16 Issue 1, p1-17. 17p.