Zobrazeno 1 - 10
of 115
pro vyhledávání: '"E, Meusel"'
Publikováno v:
Journal of Electronic Packaging. 125:531-538
The creep and crack propagation behavior of SnAg3.5, SnAg4Cu0.5, and SnPb37 (as reference) was investigated on flip chip solder joints V=1×10−12 m3. The test specimen consisted of two silicon chips (3.3×3.3 mm), bonded to each other by four flip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb5ccbb390f8d6ef3ca839b9fb4ee964
https://doi.org/10.1115/1.1604155
https://doi.org/10.1115/1.1604155
Autor:
R. Strubl, B. Riedel, W. Müller, R.‐P. Gottlöber, K. Heinemann, E. Taeger, H.‐E. Seyfarth, E. Meusel
Publikováno v:
Materialwissenschaft und Werkstofftechnik. 34:276-284
Berichtet wird uber Experimente zur Synthese neuartiger reaktiver, thermotroper flussig-kristalliner Polymere (LCPs) sowie uber Untersuchungen zum Einsatz dieser LCPs als Blendkomponente bei der Herstellung derart modifizierter Polyamid- und Polyeste
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bab587f98394baf2288329bbd48c65f2
https://doi.org/10.1002/mawe.200390059
https://doi.org/10.1002/mawe.200390059
Publikováno v:
Sensors and Actuators A: Physical. 99:188-193
The constitutive behaviour of Sn96.5Ag3.5, Sn95.5Ag4Cu0.5 and Sn63Pb37 solder was investigated on ultra small flip chip solder joints ( V =1×10 −12 m 3 ). In order to run experiments on these small specimens, a micro shear tester has been designed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c52cb07be9b9eae1e7383ff297a1fbe
https://doi.org/10.1016/s0924-4247(01)00880-9
https://doi.org/10.1016/s0924-4247(01)00880-9
Publikováno v:
Soldering & Surface Mount Technology. 12:35-39
A new concept of 3D‐electronic packaging is presented: Si‐on‐Si multi‐chip module flip‐chip technology with arrays of fine etched and filled vertical electrical interconnections (vias). Arrays of vias with a high number of interconnections,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d2905ea31609098485207e858d52c11
https://doi.org/10.1108/09540910010312429
https://doi.org/10.1108/09540910010312429
Publikováno v:
Journal of Electronic Packaging. 120:342-348
The stresses occurring in the solder joints during thermal loads have been studied by finite element analysis. Besides the cases of no underfill and perfect adhesion, underfill delaminations at the interfaces to the solder, to the chip, and to the su
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a475f4a2078538959282703fb44c4489
https://doi.org/10.1115/1.2792644
https://doi.org/10.1115/1.2792644
Publikováno v:
Polymers for Advanced Technologies. 9:806-811
A novel flipchip-like microelectronic packaging technology for bonding integrated circuits to polymer foils using laser micromachining technique and a wet chemical metallization process of conductive polymers has been developed. This paper will focus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::983a677c097fca58718ee427e09c3c6f
https://doi.org/10.1002/(sici)1099-1581(1998100)9:10/11<806::aid-pat824>3.0.co
https://doi.org/10.1002/(sici)1099-1581(1998100)9:10/11<806::aid-pat824>3.0.co
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 21:406-411
In this paper, self-heating of interconnects has been shown to affect the lifetime of next generation integrated circuits significantly more severely than today's. The paper proves the necessity for extending the system of design rules, proposes a th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f97ac15dd1ce46fa5d1e8d6bf477078d
https://doi.org/10.1109/95.725203
https://doi.org/10.1109/95.725203
Publikováno v:
Microsystem Technologies. 1:129-136
The paper presents numerical simulations and experimental investigations of flip chip modules having silicon, alumina ceramics, polyimide or polyester foil, or epoxy glass laminates as substrate material under thermo cycle test conditions. Some of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a05a69432163f9064a97a7979b541951
https://doi.org/10.1007/bf01294804
https://doi.org/10.1007/bf01294804
Akademický článek
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Publikováno v:
2006 1st Electronic Systemintegration Technology Conference.
Medical micro devices should be sterilized by one of the not so harmful processes before they are in use. Each process will be affecting the parameters of the packaging and electronic materials. This paper describes the results of experiments of gold
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::387a9e971e01d425231f77618ca71f4c
https://doi.org/10.1109/estc.2006.280171
https://doi.org/10.1109/estc.2006.280171