Zobrazeno 1 - 10
of 146
pro vyhledávání: '"E, Chain"'
Autor:
E. Chain, H. W. Florey, A. D. Gardner, N. G. Heatley, M. A. Jennings, J. Orr-Ewing, A. G. Sanders, Leonard F. Peltier
Publikováno v:
Clinical Orthopaedics and Related Research. 439:23-26
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db35a485b400f7a947bd4f5c9179b820
https://doi.org/10.1097/01.blo.0000183429.83168.07
https://doi.org/10.1097/01.blo.0000183429.83168.07
Publikováno v:
In Phytochemistry Letters May 2014 8:145-148
Autor:
E, CHAIN
Publikováno v:
Better health. 19
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::a8775cf26de9b5cfb16d07b29726c550
https://pubmed.ncbi.nlm.nih.gov/20990546
https://pubmed.ncbi.nlm.nih.gov/20990546
Autor:
A, FLEMING, E, CHAIN
Publikováno v:
Lancet (London, England). 2(6472)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::668eeadb51aeecd4d1a2e078942012ab
https://pubmed.ncbi.nlm.nih.gov/20263552
https://pubmed.ncbi.nlm.nih.gov/20263552
Autor:
Mercy Thomas, Elizabeth E. Chain
Publikováno v:
Thin Solid Films. 204:L1-L4
Deposition of AIN by metalorganic chemical vapor deposition (MOCVD) with NF 3 and NH 3 as the nitrogen source was conducted at low temperatures (below 500°C). The resultant films were examined by scanning electron microscopy (AES), and secondary ion
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::933fb2ed6ac2f83ec4beeb649a4bc223
https://doi.org/10.1016/0040-6090(91)90485-g
https://doi.org/10.1016/0040-6090(91)90485-g
Autor:
E, Chain
Publikováno v:
CMAJ : Canadian Medical Association journal = journal de l'Association medicale canadienne. 160(11)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::8fa01f757cda0164ef339697947c1b8b
https://pubmed.ncbi.nlm.nih.gov/10374007
https://pubmed.ncbi.nlm.nih.gov/10374007
Publikováno v:
SPIE Proceedings.
Historically, a number of in-line particle measurements have been performed on separate test wafers included with product wafers during polysilicon processes. By performing film thickness and particulate measurements directly on product wafers, inste
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb2fb777902c4111645add9dc7073703
https://doi.org/10.1117/12.284632
https://doi.org/10.1117/12.284632
Autor:
Mark D. Griswold, Elizabeth E. Chain
Publikováno v:
SPIE Proceedings.
As device linewidths shrink to 0.5 micrometer and below, the ECD (electrical critical dimension) technique is a good choice for in-line CD (critical dimension) measurements on conducting substrates. In this size regime, ECD is poised to replace SEM (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c18eea92625abecde1900ef3ec38e969
https://doi.org/10.1117/12.250897
https://doi.org/10.1117/12.250897
Publikováno v:
SPIE Proceedings.
In the modern semiconductor processing facility CD (critical dimension) measurements on 200-mm diameter wafers proceed in a fully automated mode requiring only wafer loading, measurement recipe loading, and a 'run' command for processing. To provide
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::211b9c95ff13d4ec57d1b4aefa5f2376
https://doi.org/10.1117/12.250910
https://doi.org/10.1117/12.250910