Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Dzmitry Starukhin"'
Autor:
Thomas Galler, Tobias Chaloun, Winfried Mayer, Kevin Krohnert, Dzmitry Starukhin, Norbert Ambrosius, Malte Schulz-Ruhtenberg, Christian Waldschmidt
Publikováno v:
IEEE Journal of Microwaves, Vol 2, Iss 1, Pp 97-107 (2022)
This work presents a novel sensor packaging and a novel transition concept for radar applications above 150 GHz based on glass material. By using laser induced deep etching (LIDE) technology, glass vias and cavities are fabricated without degrading t
Externí odkaz:
https://doaj.org/article/f29ac75363aa4cdcb2240d7a9c967186
Autor:
Ulli Hansen, Martin Schneider-Ramelow, Thomas Galler, Michael Schiffer, Dzmitry Starukhin, Tobias Chaloun, Norbert Ambrosius, Christian Waldschmidt, Malte Schulz-Ruhtenberg, Winfried Mayer, Kevin Krohnert, Georg Friedrich, Markus Wohrmann
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In this work, we present the realized versatile hermetically sealed sensor packaging platform based on glass interposers which is applicable in industrial metrology, MEMS, photonics, life sciences and process automation application, among others. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87ce252c32c5f35ce5af222e6fe6c38e
https://doi.org/10.23919/empc53418.2021.9584974
https://doi.org/10.23919/empc53418.2021.9584974
Autor:
Kevin Krohnert, Georg Friedrich, Martin Schneider-Ramelow, Markus Wohrmann, Michael Schiffer, Dzmitry Starukhin
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
In this work we present aspects of our versatile hermetically sealed sensor platform. The sealed glass package can include passive and active devices (radar, pressure, infrared sensors). Glass is used due to its ideal properties for such applications
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27f24c5aaef6ebb7ed7a53ec5fe64362
https://doi.org/10.1109/estc48849.2020.9229834
https://doi.org/10.1109/estc48849.2020.9229834
Publikováno v:
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Through Silicon Via (TSV) processing is crucial for the later performance and reliability of a device. Therefore, an accurate and efficient metrology loop to control and inspect underlying production steps is essential. Specifically, the TSV depth is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f49597971d984cbd7d689c5421bf33e0
https://doi.org/10.1109/asmc.2017.7969211
https://doi.org/10.1109/asmc.2017.7969211
Publikováno v:
Journal of Power Sources. 196:7188-7194
The mechanism of H 2 O dissociation as well as the adsorption and oxidation reaction of H 2 on yttria-stabilized zirconia (YSZ), commonly used as part of solid oxide fuel cell (SOFC) anodes, was investigated employing temperature-programmed desorptio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::832d6c6222ee7853ec2b6bd14887be2c
https://doi.org/10.1016/j.jpowsour.2010.09.090
https://doi.org/10.1016/j.jpowsour.2010.09.090
Results of combined experimental and theoretical investigations of elementary chemical reaction processes of COA¢Â�Â�CO2 gas mixtures at nickel/yttria-stabilized zirconia (Ni/YSZ) solid oxide fuel cell (SOFC) model anode systems are presented.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::14c7129a439596354790700be5e64be3
https://elib.dlr.de/71557/
https://elib.dlr.de/71557/
