Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Dzafir Shariff"'
Autor:
Daniel Studzinski, Ulli Hansen, Kwong-Loon Yam, Kok-Kheong Looi, Dzafir Shariff, Ralph Wilke, Juergen Leib, Volker Seidemann, Ha-Duong Ngo, Kenneth Tan, Florian Bieck, Nathapong Suthiwongsunthorn, Michael Topper
Publikováno v:
IEEE Transactions on Advanced Packaging. 33:713-721
Through-silicon-via (TSV) interconnects using the "via-last" approach are successfully applied for wafer-level packaging of complementary metal-oxide-semiconductor (CMOS) image sensors. Standard materials and processes are applied for redistribution
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5afa918cad213eb4bfe1b888e510f55e
https://doi.org/10.1109/tadvp.2009.2026950
https://doi.org/10.1109/tadvp.2009.2026950
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2010:1-18
Microelectronics packaging is driven by the continuous increase in demands for smaller, faster, and cheaper products with enhanced performances. Flip-chip technology and multichip packaging are developed to meet the market needs. In recent years, the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::adae699090abf49174306303afcdaf24
https://doi.org/10.4071/2010dpc-wa11
https://doi.org/10.4071/2010dpc-wa11
Autor:
Dzafir Shariff, Aung Kyaw Oo, Lily Asoy, Keith Buchanan, Chia Lai Yee, Steve Burgess, Pandi C. Marimuthu, Kath Crook, Tony Wilby, Ken Hsiao
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
This paper reports on a silicon interposer containing both Through-Silicon Vias [TSV] and Integrated Passive Devices [IPD]. The fine-pitched 30μm diameter × 100μm deep TSV connect the IPD on one side of the wafer with Re-Distribution Layer [RDL] m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e8f122befd141cdd561576eed9c7044c
https://doi.org/10.1109/ectc.2011.5898609
https://doi.org/10.1109/ectc.2011.5898609
Autor:
Yoon, Seung Wook, Hsiao, Yung Kuan, Dzafir, Shariff, Yong Chang Bum, Andy, Won Kyung Choi, Kim, Y.C., Kang, G. T., Marimuthu, Pandi C.
Publikováno v:
18th European Microelectronics & Packaging Conference; 1/ 1/2011, p1-6, 6p