Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Dylan Stow"'
Publikováno v:
IEEE Micro. 39:46-53
Monolithic three-dimensional (M3D) integration is viewed as a promising improvement over through-silicon-via-based 3-D integration due to its greater inter-tier connectivity, higher circuit density, and lower parasitic capacitance. With M3D integrati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2193aa122b19f0be8f3f387aa07ecc8
https://doi.org/10.1109/mm.2019.2937726
https://doi.org/10.1109/mm.2019.2937726
Publikováno v:
IEEE Computer Architecture Letters. 18:132-135
Die-stacked memories that integrate multiple DRAM dies into the processor package have reduced the interface bottleneck and improved efficiency, but demands for memory capacity and bandwidth remain unfulfilled. Additionally, the introduction of memor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5cdb319c2572f973de8136653f329e77
https://doi.org/10.1109/lca.2019.2941715
https://doi.org/10.1109/lca.2019.2941715
Publikováno v:
IEEE Micro. 38:22-28
After two decades of research effort, fine-pitched 3D integrated circuits are finally appearing in a growing range of industry products that leverage the benefits of high-bandwidth, high-density circuit integration. This article reflects on the histo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d3aca4e1e5bd005107407098dda59a6
https://doi.org/10.1109/mm.2018.011441561
https://doi.org/10.1109/mm.2018.011441561
Publikováno v:
DAC
Emerging Monolithic Three-Dimensional (M3D) integration technology will not only provide improved circuit density through the high-bandwidth coupling of multiple vertically-stacked layers, but it can also provide new architectural opportunities for o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b172591ca6bcdbf4ddbedea4581ea4c
https://doi.org/10.1145/3316781.3323475
https://doi.org/10.1145/3316781.3323475
Publikováno v:
SLIP
Interposer-based packaging is becoming a widespread methodology for tightly integrating multiple heterogeneous dies into a single package, with the potential to improve manufacturing yield and build larger-than-reticle-sized systems. However, interpo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ead0b0b8f6a76e21bb4c798af7d8987
https://doi.org/10.1109/slip.2019.8771333
https://doi.org/10.1109/slip.2019.8771333
Publikováno v:
AsianHOST
Reverse engineering (RE) attacks pose a serious threat to the semiconductor supply chain. In this paper, we address this problem by proposing a design flow that leverages the unique capabilities of 3D integration to synergistically combine split fabr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85216250543010defad322b56266a7fd
https://doi.org/10.1109/asianhost.2018.8607176
https://doi.org/10.1109/asianhost.2018.8607176
Publikováno v:
2017 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dab98a13c034813abb6cd9f174fc9e55
https://doi.org/10.1109/iccad.2017.8203849
https://doi.org/10.1109/iccad.2017.8203849
Publikováno v:
ACM Great Lakes Symposium on VLSI
Existing works on Three-dimensional (3D) hardware security focus on leveraging the unique 3D characteristics to address the supply chain attacks that exist in 2D design. However, 3D ICs introduce specific and unexplored challenges as well as new oppo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::de05347f1aa8b44e82c8d3752894dd5e
https://doi.org/10.1145/3060403.3060500
https://doi.org/10.1145/3060403.3060500
Publikováno v:
ICCAD
Due to the increasing fabrication and design complexity with new process nodes, the cost per transistor trend originally identified in Moore's Law is slowing when using traditional integration methods. However, emerging die-level integration technolo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::804b803f209fe587f08e50e619e59b51
https://doi.org/10.1145/2966986.2980095
https://doi.org/10.1145/2966986.2980095
Publikováno v:
ICCD
Side-channel attacks are important security challenges as they reveal sensitive information about on-chip activities. Among such attacks, the thermal side-channel has been shown to disclose the activities of key functional blocks and even encryption
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5616f025b065009a5fd8a50510979288
https://doi.org/10.1109/iccd.2016.7753336
https://doi.org/10.1109/iccd.2016.7753336