Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Dustin W. Demetriou"'
Autor:
Yuanchen Hu, Dustin W. Demetriou
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Digital twin - a real-time digital representation of the physical data center could contribute to the optimization of server arrangement and the operation of data centers. An accurate server-level model is critical to accomplish the well-represented
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13a6bbc847a48a64634b0df9145ec6f4
https://doi.org/10.1109/itherm51669.2021.9503199
https://doi.org/10.1109/itherm51669.2021.9503199
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
High performance computing and data center design and infrastructure is vital for the efficient use of supercomputers for applications such as AI and Machine Learning. This work investigates the thermal/fluid characterization of a water-cooled modula
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::19d46e0a3e751f04285fe56876c2107b
https://doi.org/10.1109/itherm51669.2021.9503286
https://doi.org/10.1109/itherm51669.2021.9503286
Autor:
Randy J. Zoodsma, Dustin W. Demetriou, A. Cory VanDeventer, Milnes P. David, Donald W. Porter
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
IBM z15™ continued a broadening of the physical transformation of the mainframe into a new "true 19-inch" frame form-factor. This was done to meet the requirements of a broad range of data centers, including supporting various energy efficiency ini
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8450c246a0c31b63a9d019266746997f
https://doi.org/10.1109/itherm51669.2021.9503152
https://doi.org/10.1109/itherm51669.2021.9503152
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
The demand for computing at extreme scale continues to drive the performance of high-performance computing systems to exascale and has recently resulted in plans worldwide to field such systems, including an acquisition of three such systems planned
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::602cd807b45e5db3c21905a7f6645af2
https://doi.org/10.1109/itherm.2019.8757229
https://doi.org/10.1109/itherm.2019.8757229
Autor:
Russell Tipton, Bahgat Sammakia, Mark Seymour, Husam A. Alissa, David Mendo, Kourosh Nemati, Dustin W. Demetriou, Ken Schneebeli
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:1361-1378
Cooling failure in data centers (DCs) is a complex phenomenon due to the many interactions between the cooling infrastructure and the information technology equipment (IT). To fully understand it, a system integration philosophy is vital to the testi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bbbdd03619921a89167e50c3173f816f
https://doi.org/10.1109/tcpmt.2016.2599025
https://doi.org/10.1109/tcpmt.2016.2599025
Publikováno v:
IBM Journal of Research and Development. 64:16:1-16:10
The IBM z15 is designed to meet the requirements of a range of data centers, while reducing costs through increased density, configuration flexibility, and cooling efficiency. The z15 is a continuation and broadening of the physical transformation of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b68656fd16719a05e2aa6375f76aeb6
https://doi.org/10.1147/jrd.2020.3008100
https://doi.org/10.1147/jrd.2020.3008100
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
As the science and engineering demand for high performance computing (HPC) grows beyond leading edge research institutions and communities to encompass routine activities of many disciplines, computing center infrastructures expand in their size, den
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5055780b34006c1ddd17a4d023778e0
https://doi.org/10.1109/itherm.2016.7517579
https://doi.org/10.1109/itherm.2016.7517579
Publikováno v:
Journal of Electronic Packaging. 138
The generation-to-generation information technology (IT) performance and density demands continue to drive innovation in data center cooling technologies. For many applications, the ability to efficiently deliver cooling via traditional chilled air c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79a7fef45ae0fbda711c5a3b92823a18
https://doi.org/10.1115/1.4032494
https://doi.org/10.1115/1.4032494
Autor:
Vikas Dhummi, H. Ezzat Khalifa, Can Isik, Harish J. Palanthandalam-Madapusi, Dustin W. Demetriou
Publikováno v:
International Journal of Ventilation. 9:359-369
Distributed demand control ventilation (DDCV) has shown potential for improving both indoor air quality (IAQ) and energy consumption over conventional ventilation systems. However, ventilation strategies based on measurements of CO2 concentrations su
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8d6e199ee65b553f001760ca3fe469d
https://doi.org/10.1080/14733315.2011.11683894
https://doi.org/10.1080/14733315.2011.11683894
Publikováno v:
IBM Journal of Research and Development. 62:16:1-16:11
The IBM z14 mainframe provides significant improvements in datacenter physical characteristics, flexibility, robustness, energy efficiency, and modeling capability relative to its predecessor, the IBM z13. In this paper, we consider these improvement
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::010993a578b03efcb3e937f1fb8e4be3
https://doi.org/10.1147/jrd.2018.2803438
https://doi.org/10.1147/jrd.2018.2803438