Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Dustin Simon"'
Autor:
Walter Voit, Dennis W. Smith, Benjamin R. Lund, Jingbo Wu, Dustin Simon, Shawna M. Liff, Daniel K. Dei, Taylor H. Ware, Duncan MacFarlane
Publikováno v:
ACS macro letters. 2(1)
Transparent, film-forming fluorinated arylene vinylene ether (FAVE) polymers with enchained triarylamine (TAA) moieties were prepared and characterized. Control over fluoro-olefin content within the backbone, as a function of base, was confirmed and
Autor:
Walter Voit, Robert L. Rennaker, Tong Kang, Conan St. John, Andrew M. Sloan, Joseph J. Pancrazio, Theodore C. Dumas, David Arreaga-Salas, Hamid Charkhkar, Dustin Simon, Daniel G. McHail, Dane W. Grasse, Gretchen L. Knaack, Radu Reit, Sakthi Rajendran
Publikováno v:
J Biomed Mater Res A
Intracortical probe technology, consisting of arrays of microelectrodes, offers a means of recording the bioelectrical activity from neural tissue. A major limitation of existing intracortical probe technology pertains to limited lifetime of 6 months
Autor:
Radu Reit, Dustin Simon, Daniel Zamorano, Walter Voit, Benjamin R. Lund, Taylor H. Ware, Shelbi Parker
Publikováno v:
ACS Applied Materials & Interfaces. 7:28673-28681
Hydrolytically stable, tunable modulus polymer networks are demonstrated to survive harsh alkaline environments and offer promise for use in long-term implantable bioelectronic medicines known as electroceuticals. Today's polymer networks (such as po
Autor:
Adrian Avendano-Bolivar, Dustin Simon, Aldo Garcia-Sandoval, David Arreaga-Salas, Radu Reit, Walter Voit, Robert L. Rennaker
Publikováno v:
ACS Applied Materials & Interfaces. 7:26614-26623
Softening neural interfaces are implanted stiff to enable precise insertion, and they soften in physiological conditions to minimize modulus mismatch with tissue. In this work, a high-charge-injection-capacity iridium electrode fabrication process is
Autor:
Dustin Simon, Zahra S. Bassampour, Abby R. Jennings, Taylor H. Ware, Walter Voit, David Y. Son
Publikováno v:
RSC Adv.. 4:39991-40002
A system of multifunctional silyl ether containing alkene and thiol monomers are synthesized and polymerized into uniform degradable networks with widely tunable thermomechanical properties. The glass transition temperature of the hydrolytically unst
Publikováno v:
Macromolecular Bioscience. 13:1640-1647
Neural interfaces provide an electrical connection between computers and the nervous system: current penetrating devices are orders-of-magnitude stiffer than surrounding tissue. In this work, recent efforts in softening electronics and utilize thiol-
Autor:
Dustin Simon, Taylor H. Ware, H. Clive Liu, Walter Voit, Tabassum Musa, Robert L. Rennaker, Andrew M. Sloan, Srikanth Vasudevan, Edward W. Keefer
Publikováno v:
Journal of Biomedical Materials Research Part B: Applied Biomaterials. 102:1-11
Neural interfaces have traditionally been fabricated on rigid and planar substrates, including silicon and engineering thermoplastics. However, the neural tissue with which these devices interact is both 3D and highly compliant. The mechanical mismat
Publikováno v:
Polymer Reviews. 53:108-129
Thermomechanical properties of smart polymers can be specifically tuned to address critical problems in neural interfaces. A compilation of materials and approaches is presented from each of three often overlapping research communities: shape memory
Autor:
H. Clive Liu, Sagar Shah, Taylor H. Ware, Michael P. Kilgard, Walter Voit, Robert L. Rennaker, Jonathan T. Reeder, Dustin Simon, Duncan J. Maitland, Navid Khodaparast, Keith Hearon
Publikováno v:
Macromolecular Materials and Engineering. 297:1193-1202
Planar electronics processing methods have enabled neural interfaces to become more precise and deliver more information. However, this processing paradigm is inherently 2D and rigid. The resulting mechanical and geometrical mismatch at the biotic–
Autor:
Jonathan T. Reeder, David Arreaga-Salas, Edward W. Keefer, Robert L. Rennaker, Dustin Simon, Walter Voit, Taylor H. Ware
Publikováno v:
Advanced Functional Materials. 22:3470-3479
A novel processing method is described using photolithography to pattern thin-fi lm fl exible electronics on shape memory polymer substrates with mechanical properties tailored to improve biocompatability and enhance adhesion between the polymer subs