Neural Upscaling from Residue-level Protein Structure Networks to Atomistic Structure

Autor: Duong, Vy, Diessner, Elizabeth, Grazioli, Gianmarc, Martin, Rachel W., Butts, Carter T.

Coarse-graining is a powerful tool for extending the reach of dynamic models of proteins and other biological macromolecules. Topological coarse-graining, in which biomolecules or sets thereof are represented via graph structures, is a particularly u

Externí odkaz: http://arxiv.org/abs/2109.06700

A Game Theoretical Approach to Broadcast Information Diffusion in Social Networks

Autor: Zinoviev, Dmitry, Duong, Vy

One major function of social networks (e.g., massive online social networks) is the dissemination of information, such as scientific knowledge, news, and rumors. Information can be propagated by the users of the network via natural connections in wri

Externí odkaz: http://arxiv.org/abs/1106.5174

A Game Theoretical Approach to Modeling Information Dissemination in Social Networks

Autor: Zinoviev, Dmitry, Duong, Vy, Zhang, Honggang

Publikováno v: D. Zinoviev, V. Duong, and H. Zhang, "A Game Theoretical Approach to Modeling Information Dissemination in Social Networks," in Proc. IMCCIC-2010, Vol. I, pp. 407--412, Orlando, FL, April 2010

One major function of social networks (e.g., massive online social networks) is the dissemination of information such as scientific knowledge, news, and rumors. Information can be propagated by the users of the network via natural connections in writ

Externí odkaz: http://arxiv.org/abs/1006.5493

Structure prediction and network analysis of chitinases from the Cape sundew, Drosera capensis

Autor: Unhelkar, Megha H., Duong, Vy T., Enendu, Kaosoluchi N., Kelly, John E., Tahir, Seemal, Butts, Carter T., Martin, Rachel W.

Publikováno v: In BBA - General Subjects March 2017 1861(3):636-643

Evaporative Wicking Phenomena on Nanotextured Surfaces

Autor: Quang N. Pham, Jonggyu Lee, Shiwei Zhang, Duong Vy Le, Yoonjin Won

Publikováno v: Journal of Electronic Packaging. 141

As modern electronics become miniaturized with high power, thermal management for electronics devices has become significant. This motivates the implementation of new cooling solutions to dissipate high-heat levels from high-performance electronics.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::7e6b1cd73ef55a2af0389306349d35b2
https://doi.org/10.1115/1.4044373