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Autor:
Ding J; Security and Disruptive Technologies Portfolio, National Research Council Canada, 1200 Montreal Road, M-12, Ottawa, Ontario K1A 0R6, Canada. Jianfu.ding@nrc-cnrc.gc.ca., Li Z, Lefebvre J, Cheng F, Dunford JL, Malenfant PR, Humes J, Kroeger J
Publikováno v:
Nanoscale [Nanoscale] 2015 Oct 14; Vol. 7 (38), pp. 15741-7. Date of Electronic Publication: 2015 Sep 09.
Autor:
Costa, Maria Joseíta dos Santos1 (AUTHOR), Lima, Aline Estefany Brandão1 (AUTHOR), Ribeiro, Ester Pamponet2 (AUTHOR), Costa, Gilson dos Santos1 (AUTHOR), Longo, Elson3 (AUTHOR), da Luz Jr, Geraldo Eduardo1,2 (AUTHOR), Cavalcante, Laecio Santos2 (AUTHOR) laeciosc@gmail.com, Santos, Reginaldo da Silva1,2 (AUTHOR)
Publikováno v:
Journal of Applied Electrochemistry. Jul2023, Vol. 53 Issue 7, p1349-1367. 19p.
Autor:
Dunford JL; Department of Chemistry, University of Toronto, Toronto, ON, M5S 3H6, Canada., Dhirani AA
Publikováno v:
Nanotechnology [Nanotechnology] 2008 Nov 12; Vol. 19 (45), pp. 455402. Date of Electronic Publication: 2008 Oct 08.
Autor:
Dunford JL; Department of Chemistry, University of Toronto, Ontario, Canada, M5S 3H6., Dhirani AA
Publikováno v:
Physical review letters [Phys Rev Lett] 2008 Apr 11; Vol. 100 (14), pp. 147202. Date of Electronic Publication: 2008 Apr 08.
Autor:
Dunford JL; Department of Chemistry, University of Toronto, Toronto, ON, M5S 3H6, Canada., Dhirani AA
Publikováno v:
Nanotechnology [Nanotechnology] 2008 Jan 16; Vol. 19 (2), pp. 025202. Date of Electronic Publication: 2007 Dec 06.
Autor:
Balasubramanian, V1 (AUTHOR), Daniel, T1 (AUTHOR), Henry, J1 (AUTHOR), Sivakumar, G2 (AUTHOR), Mohanraj, K1 (AUTHOR) kmohanraj.msu@gmail.com
Publikováno v:
Bulletin of Materials Science. 2020, Vol. 43 Issue 1, p1-8. 8p.
Autor:
Huotari, J.1 joni.huotari@ee.oulu.fi, Lappalainen, J.1
Publikováno v:
Journal of Materials Science. Feb2017, Vol. 52 Issue 4, p2241-2253. 13p.
Publikováno v:
Journal of Materials Science: Materials in Electronics; Oct2021, Vol. 32 Issue 19, p23923-23934, 12p
Publikováno v:
Journal of Materials Science: Materials in Electronics; Jul2020, Vol. 31 Issue 13, p10142-10150, 9p