Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Dun-Nien Yaung"'
Autor:
Seiji Takahashi, Yi-Min Huang, Jhy-Jyi Sze, Tung-Ting Wu, Fu-Sheng Guo, Wei-Cheng Hsu, Tung-Hsiung Tseng, King Liao, Chin-Chia Kuo, Tzu-Hsiang Chen, Wei-Chieh Chiang, Chun-Hao Chuang, Keng-Yu Chou, Chi-Hsien Chung, Kuo-Yu Chou, Chien-Hsien Tseng, Chuan-Joung Wang, Dun-Nien Yaung
Publikováno v:
Sensors, Vol 17, Iss 12, p 2816 (2017)
A submicron pixel’s light and dark performance were studied by experiment and simulation. An advanced node technology incorporated with a stacked CMOS image sensor (CIS) is promising in that it may enhance performance. In this work, we demonstrated
Externí odkaz:
https://doaj.org/article/e943c9552b8649ad8783b651839b2c7f
Autor:
Chi-Hsien Chung, Chiang Wei-Chieh, Kuo-Yu Chou, Tzu-Hsiang Chen, Tseng Chien-Hsien, Tung-Ting Wu, Takahashi Seiji, Chin-Chia Kuo, Chuan-Joung Wang, Huang Yimin, Dun-Nien Yaung, Chuang Chun-Hao, King Liao, Tung-Hsiung Tseng, Fu-Sheng Guo, Jhy-Jyi Sze, Hsu Wei-Cheng, Chou Keng-Yu
Publikováno v:
Sensors, Vol 17, Iss 12, p 2816 (2017)
Sensors; Volume 17; Issue 12; Pages: 2816
Sensors (Basel, Switzerland)
Sensors; Volume 17; Issue 12; Pages: 2816
Sensors (Basel, Switzerland)
A submicron pixel’s light and dark performance were studied by experiment and simulation. An advanced node technology incorporated with a stacked CMOS image sensor (CIS) is promising in that it may enhance performance. In this work, we demonstrated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ac67032e3f5a8aeb975f5a08156255f4
https://www.mdpi.com/1424-8220/17/12/2816
https://www.mdpi.com/1424-8220/17/12/2816
Autor:
Shou-Gwo Wuu, Chin-Hao Chang, Jen-Cheng Liu, Dun-Nien Yaung, Fu-Lung Hsueh, Calvin Yi-Ping Chao, Honyih Tu, Vincent Hsu, Charles C. C. Liu, Szu-Ying Chen
Publikováno v:
VLSIC
A 1.1 um pitch pixel array fabricated by 45 nm 3D stacked technology, can be switched to peripheral circuits on same wafer or to other stacked wafer for process and signal integrity verification. It supports through silicon connection or direct conne
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a5262dd26d6ae89ea439aac95359e5ba
https://doi.org/10.1109/vlsic.2014.6858370
https://doi.org/10.1109/vlsic.2014.6858370
Autor:
Liu, Charles Chih-Min, Chin-Hao Chang, Hon-Yih Tu, Chao, Calvin Yi-Ping, Fu-Lung Hsueh, Szu-Ying Chen, Hsu, Vincent, Jen-Cheng Liu, Dun-Nien Yaung, Shou-Gwo Wuu
Publikováno v:
2014 Symposium on VLSI Circuits Digest of Technical Papers; 2014, p1-2, 2p