Zobrazeno 1 - 10
of 175
pro vyhledávání: '"Duixian Liu"'
Publikováno v:
IEEE Journal of Microwaves, Vol 1, Iss 1, Pp 123-134 (2021)
This article reviews current research and development as well as future opportunities for packaging and antenna integration technologies for silicon-based millimeter-wave phased arrays in emerging communication applications. Implementations of state-
Externí odkaz:
https://doaj.org/article/9817296e859e404980e84a20b84c7999
Publikováno v:
International Journal of Antennas and Propagation, Vol 2013 (2013)
Externí odkaz:
https://doaj.org/article/600ec68883f44b2da156953e06cafe85
Autor:
Bodhisatwa Sadhu, Arun Paidimarri, Duixian Liu, Mark Yeck, Caglar Ozdag, Yujiro Tojo, Wooram Lee, Kevin Xiaoxiong Gu, Jean-Olivier Plouchart, Christian W. Baks, Yusuke Uemichi, Sudipto Chakraborty, Yo Yamaguchi, Ning Guan, Alberto Valdes-Garcia
Publikováno v:
IEEE Journal of Solid-State Circuits. 57:3599-3616
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47108a8dbbd6550c39cd3663860b2c2b
https://doi.org/10.1109/jssc.2022.3204807
https://doi.org/10.1109/jssc.2022.3204807
Publikováno v:
2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::be7b7b2449da60caa32ac13c902fed20
https://doi.org/10.1109/ap-s/usnc-ursi47032.2022.9887355
https://doi.org/10.1109/ap-s/usnc-ursi47032.2022.9887355
Autor:
Duixian Liu, Xiaoxiong Gu
Publikováno v:
Antenna-in-Package Technology and Applications
The increasing capabilities of high‐speed silicon technologies have made millimeter‐wave frequencies attractive for low‐cost applications. This chapter focuses on large‐array antenna‐in‐package (AiP) designs based on surface laminar circu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c52f2d07496e62936f4ee985eefa67c
https://doi.org/10.1002/9781119556671.ch10
https://doi.org/10.1002/9781119556671.ch10
Autor:
Yuki Suto, Bodhisatwa Sadhu, Yuta Hasegawa, Arun Paidimarri, Duixian Liu, Xiaoxiong Gu, Ning Guan, Yujiro Tojo, Christian W. Baks, Alberto Valdes-Garcia
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
This paper presents novel antenna designs and integration methods that enable a low-cost scalable antenna-in-package (AiP) phased-array solution for wideband wireless communication covering 24 GHz - 30 GHz (N257, N258 and N261 5G bands). A total numb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::946f50373979502a3569ca8a0abeea69
https://doi.org/10.1109/ectc32696.2021.00187
https://doi.org/10.1109/ectc32696.2021.00187
Autor:
Yue Ping Zhang, Rob Maaskant, Atif Shamim, Bart Smolders, Duixian Liu, Dirk Manteuffel, Wonbin Hong, Hua Wang
Publikováno v:
IEEE Antennas and Wireless Propagation Letters, 18(11):8891841, 2345-2350. Institute of Electrical and Electronics Engineers
The twenty peer-reviewed letters in this special section examine the design and cointegration of antenna-in-package (AiP), antenna-on-chip (AoC), and antenna ICs (AIC). The letters are categorized in the four distinctive categories: 1) Fabrication te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::638bc8ee8df0e4c8d499486ae7709276
http://www.scopus.com/inward/record.url?scp=85075023300&partnerID=8YFLogxK
http://www.scopus.com/inward/record.url?scp=85075023300&partnerID=8YFLogxK
Autor:
Bodhisatwa Sadhu, Pritish R. Parida, Leonard Rexberg, Young H. Kwark, Ola Tageman, Xiaoxiong Gu, Joakim Hallin, Alberto Valdes-Garcia, Duixian Liu, Christian W. Baks
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 67:2975-2984
Silicon-based millimeter-wave (mm-wave) phased-array technologies are enabling directional wireless data communications at Gb/s speeds. In this paper, we review and discuss the challenges of implementing a multichip phased-array antenna module for mm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55771c46e3285afb156c7f885627293a
https://doi.org/10.1109/tmtt.2019.2912819
https://doi.org/10.1109/tmtt.2019.2912819
Autor:
Xiaoxiong Gu, Alberto Valdes-Garcia, Herschel A. Ainspan, Duixian Liu, Jean-Olivier Plouchart, Bodhisatwa Sadhu, Daniel J. Friedman, Christian W. Baks, Mihai Sanduleanu, Arpit K. Gupta, Mark Ferriss, Mark Yeck
Publikováno v:
IEEE Journal of Solid-State Circuits. :1-14
In this article, we present a low-power, small form-factor, 60-GHz packaged radio featuring broad beam coverage. We increase angular coverage by beam switching between two orthogonally pointed low directivity beams that are created using two differen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af08b418d2a6f838af98b8e17c0bb136
https://doi.org/10.1109/jssc.2019.2943918
https://doi.org/10.1109/jssc.2019.2943918
Autor:
Mark Ferriss, Alberto Valdes-Garcia, Orjan Renstrom, Anders Carlinger, N. Mazor, Kristoffer Sjogren, Jan-Erik Thillberg, Xiaoxiong Gu, Yahya Tousi, Eric Westesson, Hakan Bengtsson, Mark Yeck, Duixian Liu, Scott K. Reynolds, Joakim Hallin, Bo Bokinge, Bodhisatwa Sadhu, Olov Haapalahti, Stefan Sahl, Daniel J. Friedman, Leonard Rexberg, Gustaf Weibull
Publikováno v:
IEEE Journal of Solid-State Circuits. 52:3373-3391
This paper presents the first reported 28-GHz phased-array IC for 5G communications. Implemented in 130-nm SiGe BiCMOS, the IC includes 32 TRX elements and features concurrent independent beams in two polarizations in either TX or RX operation. Circu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::06b09927ceb448cb404587004dabb9a6
https://doi.org/10.1109/jssc.2017.2766211
https://doi.org/10.1109/jssc.2017.2766211