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Impact of processing conditions and solder materials on surface mount assembly defects

Autor: Raiyo Aspandiar, Steve Vandervoort, Gregorio R. Murtagian, Dudi Amir, Rajen S. Sidhu

Publikováno v: JOM. 63:47-51

The conversion to lead-free solder alloys and increasing dynamic warpage due to the coefficient of thermal expansion (CTE) mismatch and thinner microelectronic packaging technology has resulted in a significant increase in the risk of solder joint de

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ba4ca102e0021e4e1feda1d6dc333d0f
https://doi.org/10.1007/s11837-011-0174-3

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Solder Joint Reliability Improvement Using the Cold Ball Pull Metrology

Autor: George F. Raiser, Dudi Amir

Publikováno v: Advances in Electronic Packaging, Parts A, B, and C.

The various methods for improvement of package solder joint reliability (SJR) have centered on the broad categories of (i) reductions in the thermomechanical and mechanical stresses and strains applied to the joints, and (ii) strengthening of the sol

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a138c817d877eb934567d950e5b82185
https://doi.org/10.1115/ipack2005-73045

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Design and Assembly Methods for Improving High Current Board-Component Connectivity

Autor: Dudi Amir, Terry Dishongh, Damion Searls, Jung Kang

Publikováno v: 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1.

Development of higher performance silicon products often leads to more stringent demands on power delivery. Higher current sustainability is often a key parameter in successful power delivery design. One potential bottleneck in the delivery of power

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::f16bb8ae03c16f6c1ee218df90806a3b
https://doi.org/10.1115/ipack2003-35204

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