Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Du Xiurong"'
Publikováno v:
陆军军医大学学报, Vol 46, Iss 7, Pp 715-724 (2024)
Objective To explore the effects of HPV16 E6 on genes and signaling pathways in cervical epithelial cells and to screen genes associated with oncogenic transformation. Methods HUCEC models infected with HPV16 E6 were constructed, and transcriptome se
Externí odkaz:
https://doaj.org/article/91778ef6433344788e683ce5a283860c
Publikováno v:
Heliyon, Vol 10, Iss 10, Pp e29881- (2024)
Objective: To construct models of high-risk human papillomavirus (HPV) infection with precancerous lesions or cervical cancer and explore the immune function. Methods: Using CRISPR/Cas9, the expression vector HPV16-E6-E7-Rosa26 was microinjected into
Externí odkaz:
https://doaj.org/article/0c31498c3f584532a315d3f16cf578f4
Publikováno v:
陆军军医大学学报, Vol 45, Iss 2, Pp 130-138 (2023)
Objective To investigate the biological and metabolic roles of WNK2 in regulation of ovarian cancer based on transcriptome sequencing technology. Methods Ovarian cancer SKOV3 cells were divided into experimental group and control group, with 3 replic
Externí odkaz:
https://doaj.org/article/01bdb6d18acf4bc18136c89dfa04d6ac
Autor:
Du Xiurong, Chao Chen
Publikováno v:
E3S Web of Conferences, Vol 512, p 02006 (2024)
This article takes the underpass of Yangangdong Interchange in Shenzhen as the research background, uses MIDAS/GTS for modeling and numerical analysis, and conducts research on the initial support steel frame, reinforced concrete structure, and geote
Externí odkaz:
https://doaj.org/article/849d2c97f3fc43ae830e1a883647dd6b
Akademický článek
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Autor:
Yu, Xinmin, Du, Xiurong, Song, Xuefu, Zhu, Yongchang, Liu, Xing, Zhou, Lisheng, Zhu, Xueyi, Qiu, Kai
Publikováno v:
Applied Sciences (2076-3417); Oct2024, Vol. 14 Issue 19, p9137, 10p
Publikováno v:
International Conference on Optoelectronic and Microelectronic Technology and Application.
The fused silica glass is needed in the electronics and micro manufacturing industry. The thickness requirement is 0.02 ~ 0.2mm, which is difficult to be achieved by traditional machining. In this paper, a new thinning technology is proposed. Through
Publikováno v:
International Conference on Optoelectronic and Microelectronic Technology and Application.
Publikováno v:
AOPC 2020: Optics Ultra Precision Manufacturing and Testing.
To investigate the distribution characteristics of subsurface damage in fused silica, three different machining methods - cutting, grinding and lapping were adopted. The method of combination of step-by-step polishing and wet etching were applied to
Publikováno v:
Second Target Recognition and Artificial Intelligence Summit Forum.