Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Du, Shilei"'
Autor:
Wang, Vivian Hsing-Chun, Cuevas, Adolfo G., Osokpo, Onome Henry, Chang, Ji Eun, Zhang, Donglan, Hu, Anqing, Yun, Jeongwook, Lee, Adaora, Du, Shilei, Williams, David R., Pagán, José A.
Publikováno v:
In American Journal of Preventive Medicine October 2024 67(4):568-580
Publikováno v:
2022 China Automation Congress (CAC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f857f40ebb6798531a8e318c24d93e6c
https://doi.org/10.1109/cac57257.2022.10055658
https://doi.org/10.1109/cac57257.2022.10055658
Publikováno v:
2022 China Automation Congress (CAC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6af9aab05b729a036834653d7fc19355
https://doi.org/10.1109/cac57257.2022.10055547
https://doi.org/10.1109/cac57257.2022.10055547
Publikováno v:
2022 China Automation Congress (CAC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b8447d65200baf38fa152dc503ce7d24
https://doi.org/10.1109/cac57257.2022.10055521
https://doi.org/10.1109/cac57257.2022.10055521
Publikováno v:
2021 China Automation Congress (CAC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5925285b1627755c5c0182a1460803be
https://doi.org/10.1109/cac53003.2021.9727271
https://doi.org/10.1109/cac53003.2021.9727271
Publikováno v:
IOP Conference Series: Materials Science & Engineering; Dec2018, Vol. 452 Issue 4, p1-1, 1p
Autor:
Du, Huiyu, Gao, Shilei, Dong, Wenyong, Huang, Qi, Qu, Huiyun, Zhang, Chen, Guo, Linya, Liu, Zhilan, Liu, Min
Publikováno v:
Journal of Clinical Hypertension; Mar2024, Vol. 26 Issue 3, p295-298, 4p
Autor:
Wang, Zhangming1 (AUTHOR), Zhang, Nan1 (AUTHOR), Du, Xianting1 (AUTHOR), Wang, Shilei2 (AUTHOR), Sun, Qikai1 (AUTHOR)
Publikováno v:
Journal of Advanced Transportation. 1/15/2021, p1-13. 13p.
Publikováno v:
Journal of Materials Chemistry C; 8/28/2023, Vol. 11 Issue 32, p10775-10784, 10p
Publikováno v:
Mechanical Sciences; 2022, Vol. 13 Issue 1, p577-584, 8p