Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Dow Electronic Materials"'
Autor:
Anupam Choubey, Hua Dong, Joe Lachowski, Jong-Uk Kim, Kai Zoschke, Masaki Kondo, Corey O'connor, Michael Toepper, Rosemary Bell, Christina Lopper, Dow Electronic Materials, Matthias Wegner, Michael K. Gallagher, Bob Barr, Fraunhofer Izm, Greg Prokopowicz
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:000886-000912
The microelectronics industry is being continually challenged to decrease package size, lower power consumption and improve device performance for the mobile communication and server markets. In order to keep pace with these requirements, device manu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5da3fbf50eeff1ef568161ab9abc737
https://doi.org/10.4071/2014dpc-tp24
https://doi.org/10.4071/2014dpc-tp24
Autor:
Chen X; 1 Analytical Sciences, The Dow Chemical Company, Midland, MI, USA., Eldred D; 2 Dow Performance Silicones, The Dow Chemical Company, Auburn, MI, USA., Liu J; 3 Process & Engineering Sciences, The Dow Chemical Company, Midland, MI, USA., Chiang H; 3 Process & Engineering Sciences, The Dow Chemical Company, Midland, MI, USA., Wang X; 2 Dow Performance Silicones, The Dow Chemical Company, Auburn, MI, USA., Rickard MA; 1 Analytical Sciences, The Dow Chemical Company, Midland, MI, USA., Tu S; 3 Process & Engineering Sciences, The Dow Chemical Company, Midland, MI, USA., Cui L; 4 Dow Electronic Materials, Marlborough, MA, USA., LaBeaume P; 4 Dow Electronic Materials, Marlborough, MA, USA., Skinner K; 5 Dow Performance Silicones Process R&D, The Dow Chemical Company, Midland, MI, USA.
Publikováno v:
Applied spectroscopy [Appl Spectrosc] 2018 Sep; Vol. 72 (9), pp. 1404-1415. Date of Electronic Publication: 2018 May 14.
Autor:
Sattler W; The Dow Chemical Company, Formulation Science, Core R&D , 400 Arcola Road, Collegeville, Pennsylvania 19426, United States.; Beckman Institute, California Institute of Technology , Pasadena, California 91125, United States., Rachford AA; The Dow Chemical Company, Dow Electronic Materials , 455 Forest Street, Marlborough, Massachusetts 01752, United States., LaBeaume PJ; The Dow Chemical Company, Dow Electronic Materials , 455 Forest Street, Marlborough, Massachusetts 01752, United States., Coley SM; The Dow Chemical Company, Dow Electronic Materials , 455 Forest Street, Marlborough, Massachusetts 01752, United States., Thackeray JW; The Dow Chemical Company, Dow Electronic Materials , 455 Forest Street, Marlborough, Massachusetts 01752, United States., Cameron JF; The Dow Chemical Company, Dow Electronic Materials , 455 Forest Street, Marlborough, Massachusetts 01752, United States., Müller AM; Beckman Institute, California Institute of Technology , Pasadena, California 91125, United States., Winkler JR; Beckman Institute, California Institute of Technology , Pasadena, California 91125, United States., Gray HB; Beckman Institute, California Institute of Technology , Pasadena, California 91125, United States.
Publikováno v:
The journal of physical chemistry. A [J Phys Chem A] 2017 Oct 12; Vol. 121 (40), pp. 7572-7575. Date of Electronic Publication: 2017 Sep 28.
Autor:
Page ZA; Materials Research Laboratory and Department of Chemistry and Biochemistry, University of California Santa Barbara, California 93106, United States., Narupai B; Materials Research Laboratory and Department of Chemistry and Biochemistry, University of California Santa Barbara, California 93106, United States.; Materials Research Laboratory and Department of Chemistry and Biochemistry, University of California Santa Barbara, California 93106, United States., Pester CW; Materials Research Laboratory and Department of Chemistry and Biochemistry, University of California Santa Barbara, California 93106, United States., Bou Zerdan R; Materials Research Laboratory and Department of Chemistry and Biochemistry, University of California Santa Barbara, California 93106, United States., Sokolov A; The Dow Chemical Company, Midland, Michigan 48674, United States., Laitar DS; The Dow Chemical Company, Midland, Michigan 48674, United States., Mukhopadhyay S; The Dow Chemical Company, Midland, Michigan 48674, United States., Sprague S; The Dow Chemical Company, Midland, Michigan 48674, United States., McGrath AJ; Materials Research Laboratory and Department of Chemistry and Biochemistry, University of California Santa Barbara, California 93106, United States., Kramer JW; The Dow Chemical Company, Midland, Michigan 48674, United States., Trefonas P; The Dow Electronic Materials Company, 455 Forest Street, Marlborough, Massachusetts 01752, United States., Hawker CJ; Materials Research Laboratory and Department of Chemistry and Biochemistry, University of California Santa Barbara, California 93106, United States.; Materials Research Laboratory and Department of Chemistry and Biochemistry, University of California Santa Barbara, California 93106, United States.
Publikováno v:
ACS central science [ACS Cent Sci] 2017 Jun 28; Vol. 3 (6), pp. 654-661. Date of Electronic Publication: 2017 Jun 07.
Autor:
Oh N; Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. 5nuri.oh@gmail.com mshim@illinois.edu., Kim BH; Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Cho SY; Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Nam S; Information Control Device Research Section, Electronics and Telecommunications Research Institute, Daejeon, 305-700, Republic of Korea., Rogers SP; Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Jiang Y; Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Flanagan JC; Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Zhai Y; Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Kim JH; Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Lee J; Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Yu Y; Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Cho YK; Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Hur G; Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Zhang J; Dow Electronic Materials, 455 Forest Street, Marlborough, MA 01752, USA., Trefonas P; Dow Electronic Materials, 455 Forest Street, Marlborough, MA 01752, USA., Rogers JA; Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA., Shim M; Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA. 5nuri.oh@gmail.com mshim@illinois.edu.
Publikováno v:
Science (New York, N.Y.) [Science] 2017 Feb 10; Vol. 355 (6325), pp. 616-619.