Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Douglas S. McKenzie"'
Autor:
Jose A, Cancelas, Neeta, Rugg, Shawnagay, Nestheide, Sarah E, Hill, R Martin, Emanuele, Douglas S, Mckenzie
Publikováno v:
Blood transfusion = Trasfusione del sangue. 15(2)
Use of the plasticiser di(2-ethylhexyl) phthalate (DEHP) in polyvinyl chloride (PVC) blood bags poses a potential dilemma. The presence of DEHP in blood bags has been shown to be beneficial to red blood cells during storage by diminishing haemolysis.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::c436327003e819948b77508dcb52441d
https://pubmed.ncbi.nlm.nih.gov/28263175
https://pubmed.ncbi.nlm.nih.gov/28263175
Autor:
Eric L. Alemy, Woo-Kyu Kim, Jae-Chang Jung, Takanori Kudo, Jun-Sung Chun, Ki-Soo Shin, Douglas S. McKenzie, Munirathna Padmanaban, Hyeong-Soo Kim, M. Dalil Rahman, Sang-Ho Lee, Andrew R. Romano, Seiya Masuda, Sung-Koo Lee, Ralph R. Dammel
Publikováno v:
Journal of Photopolymer Science and Technology. 15:549-558
This paper discusses the 193nm lithography of contact holes with various pitches for 100nm node. We have studied 193nm contact hole resists in view of resist components, process conditions and optical settings. Sidewall roughness was improved by opti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7b642eaa85ada18b13b99ef86302878
https://doi.org/10.2494/photopolymer.15.549
https://doi.org/10.2494/photopolymer.15.549
Autor:
Munirathna Padmanaban, Takanori Kudo, Eric L. Alemy, Ralph R. Dammel, Woo-Kyu Kim, M. Dalil Rahman, Douglas S. McKenzie, Waiman Ng, Jun-Born Bae
Publikováno v:
Journal of Photopolymer Science and Technology. 14:407-417
Pattern deformation during SEM inspection has been investigated for different types of 193nm positive resists. The mechanism of the CD changes is discussed based on the slimming rate analyses as well as on the e-beam penetration depth. As a general t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f737ea32a569bc61e06ce83f1f4bf9de
https://doi.org/10.2494/photopolymer.14.407
https://doi.org/10.2494/photopolymer.14.407
Autor:
Ralph R. Dammel, Allen Timko, Chi-Sun Hong, Guanyang Lin, Sang-Ho Lee, Douglas S. McKenzie, Takanori Kudo, Clement Anyadiegwu, Woo-Kyu Kim, Dalil Rahman, Munirathna Padmanaban
Publikováno v:
SPIE Proceedings.
Keeping post exposure bake (PEB) sensitivity low has become one of the most crucial factors for implementing the 193nm resist process into mass production. In a previous report, we have demonstrated that the nature of the photo acid generator (PAG) h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7204146e9cd0551e09f49ecaeee0169e
https://doi.org/10.1117/12.537931
https://doi.org/10.1117/12.537931
Autor:
Dalil Rahman, Takanori Kudo, Ralph R. Dammel, Munirathna Padmanaban, Douglas S. McKenzie, Sang-Ho Lee, Woo-Kyu Kim
Publikováno v:
Advances in Resist Technology and Processing XX.
The performance of a new class of photoacid generators (PAGs) made from the onium salts of bis(perfluoroalkylsulfonyl)imide and tris(perfluoroalkylsulfonyl)methide anions were studied in 193nm formulations. The lithographic properties such as sensiti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99830414c6a4dc511d47128cb647b3fb
https://doi.org/10.1117/12.487738
https://doi.org/10.1117/12.487738
Autor:
Sang-Ho Lee, Clement Anyadiegwu, Dalil Rahman, Munirathna Padmanaban, Douglas S. McKenzie, Allen Timko, Ralph R. Dammel, Woo-Kyu Kim, Takashi Kanda, Takanori Kudo
Publikováno v:
Advances in Resist Technology and Processing XX.
In an effort to develop a production-worthy 193-resist, it is important to understand the critical factors that impacts the CD variation during a routine photo lithographic process. A comprehensive investigation was done on factors affecting PEB sens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10a67ca71b3a847fde6ac0f52068f577
https://doi.org/10.1117/12.485183
https://doi.org/10.1117/12.485183
Autor:
Dalil Rahman, Sang-Ho Lee, Ralph R. Dammel, Seiya Masuda, Takanori Kudo, Will Conley, Douglas S. McKenzie, Munirathna Padmanaban, Woo-Kyu Kim, Eric L. Alemy, Daniel Miller
Publikováno v:
SPIE Proceedings.
A high performance 193 nm resist has been developed from a novel hybrid copolymer based on a cycloolefin-maleic anhydride and methacrylate (COMA/Methacrylate) polymer system. A variety of copolymers have been synthesized from t-butyl norbornene carbo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::263a4da9c077d12bb15bfbb36fce075c
https://doi.org/10.1117/12.474210
https://doi.org/10.1117/12.474210
Autor:
Hyeong-Soo Kim, Takanori Kudo, Jae Chang Jung, Seiya Masuda, Munirathna Padmanaban, Douglas S. McKenzie, Dalil Rahman, Sang-Ho Lee, Jun-Sung Chun, Andrew R. Romano, Sung-Koo Lee, Woo-Kyu Kim, Eric L. Alemy, Ralph R. Dammel, Ki-Soo Shin
Publikováno v:
SPIE Proceedings.
We have studied 193 nm contact hole resists in view of resist components, process conditions and optical settings. Sidewall roughness was improved by optimizing photoacid generators. Side lobes were eliminated by applying higher post exposure bake te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d466455ed349d68f5c79a87a010842da
https://doi.org/10.1117/12.474214
https://doi.org/10.1117/12.474214
Autor:
Wan-Lin Chen, Takanori Kudo, Aldo Orsi, Eric L. Alemy, Sang-Ho Lee, Dalil Rahman, Woo-Kyu Kim, Munirathna Padmanaban, Ralph R. Dammel, Reza Sadjadi, Matthew F. Ross, William R. Livesay, Douglas S. McKenzie
Publikováno v:
SPIE Proceedings.
Electron beam (e-beam) curing techniques are known to improve etch and CD-SEM stability of 248 and 193nm resists. The effects of three different e-beam curing processes (standard, LT and ESC) on the methacrylate and hybrid type 193nm resists were stu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eac27ff81fb14d41f2b60ec30c281328
https://doi.org/10.1117/12.474262
https://doi.org/10.1117/12.474262
Publikováno v:
SPIE Proceedings.
Modern resists require very pure raw materials to insure highest quality images. Many methods have been developed to reduce metals in resins used to make photoresists. Extractive washing techniques and ion exchange methods have been the predominant m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::776a2f9e4b2b4a196784377e6c51e8b3
https://doi.org/10.1117/12.436877
https://doi.org/10.1117/12.436877