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Autor:
Kannan Sekar, Neerja Bawaskar, Huaxing Tang, Matt Knowles, Gaurav Veda, Wu-Tung Cheng, Manish Sharma, Douglas Gehringer, Yan Pan, Jayant D'Souza
Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Device complexity is reaching all-time highs with the adoption of high aspect ratio FinFETs created using multi- patterning process technologies. Simultaneously, new product segments such as AI and automotive are being fabricated on such advanced pro