Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Douglas Charles La Tulipe"'
Autor:
Soeren Steudel, Johan Vertommen, Emmanuel Le Boulbar, Giuseppe Buscemi, Lars Bach, Stefaan Van Huylenbroeck, Hariharan Arumugam, Douglas Charles La Tulipe, Joeri De Vos, Andy Miller, Haris Osman, Kenneth June Rebibis
Publikováno v:
SID Symposium Digest of Technical Papers. 53:748-751
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c5309c3c3f071e7b063f266a3cfd13c
https://doi.org/10.1002/sdtp.15598
https://doi.org/10.1002/sdtp.15598
Autor:
Aleksandrs Marinins, Sebastian Hansch, Huseyin Sar, Francois Chancerel, Negin Golshani, Hsiao-Lun Wang, Artemisia Tsiara, David Coenen, Peter Verheyen, Giovanni Capuz, Yannick De Koninck, Ozan Yilmaz, Geert Morthier, Filip Schleicher, Geraldine Jamieson, Stuart Smyth, Andrew McKee, Yoojin Ban, Marianna Pantouvaki, Douglas Charles La Tulipe, Joris Van Campenhout
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. :1-11
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::814c79531151233db988d3b0c6344c4e
https://doi.org/10.1109/jstqe.2022.3223641
https://doi.org/10.1109/jstqe.2022.3223641
Autor:
Yoav Grauer, Andy Miller, Douglas Charles La Tulipe, Amnon Manassen, Shlomo Eisenbach, Ohad Bachar, Roel Gronheid
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c0056f08b162a6e558f07055ec32055
https://doi.org/10.1117/12.2608319
https://doi.org/10.1117/12.2608319
Autor:
Carine Gerets, Jaber Derakhshandeh, Ehsan Shafahian, Tom Cochet, Douglas Charles La Tulipe, Gerald Beyer, Andy Miller, Eric Beyne
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30d06924697997c0a66f3814e8961a7d
https://doi.org/10.23919/icep55381.2022.9795375
https://doi.org/10.23919/icep55381.2022.9795375
Autor:
Jaber Derakhshandeh, Douglas Charles La Tulipe, Giovanni Capuz, Vladimir Cherman, Carine Gerets, Tom Cochet, Ehsan Shafahian, Inge De Preter, Geraldine Jamieson, Tomas Webers, Eric Beyne, Gerald Beyer, Andy Miller
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a831ba88df1e8733e67b6f5989cd3ff6
https://doi.org/10.23919/icep55381.2022.9795565
https://doi.org/10.23919/icep55381.2022.9795565
Autor:
Jaber Derakhshandeh, Eric Beyne, Gerald Beyer, Giovanni Capuz, Vladimir Cherman, Inge De Preter, Carine Gerets, Ehsan Shafahian, Koen Kennes, Geraldine Jamieson, Tom Cochet, Tomas Webers, Bert Tobback, Geert Van der Plas, Douglas Charles La Tulipe, Alain Phommahaxay, Andy Miller
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4da21639abe97e29bc350a9862b24c3e
https://doi.org/10.1109/ectc51906.2022.00179
https://doi.org/10.1109/ectc51906.2022.00179
Autor:
Ehsan Shafahian, Carine Gerets, Eric Beyne, Masataka Maehara, Vladimir Cherman, G. Jamieson, Pieter Bex, Jaber Derakhshandeh, Inge De Preter, Julien Bertheau, Andy Miller, Fumihiro Inoue, T. Webers, Melina Lofrano, Tom Cochet, Lin Hou, Giovanni Capuz, Geert Van der Plas, Gerald Beyer, Douglas Charles La Tulipe
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this paper full integration flow for a low temperature (150°C) and high throughput die to wafer bonding method is introduced for microbumps pitches down to $10 \mu \mathrm{m}$ . The impact of Co plating chemistry, Sn thickness, annealing temperat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5cfeeb4cc427d4dab249085f66d02da8
https://doi.org/10.1109/ectc32696.2021.00183
https://doi.org/10.1109/ectc32696.2021.00183
Autor:
Samuel Suhard, Koen Kennes, Gerald Beyer, Jash Patel, Huma Ashraf, Anne Jourdain, Chris Bolton, Ferenc Fodor, Pieter Bex, Lieve Teugels, Eric Beyne, Edward Walsby, Richard Barnett, Alain Phommahaxay, Douglas Charles La Tulipe
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In this paper, a collective hybrid bonding of a die to wafer integration using glass wafer is demonstrated. The key process steps such as thinning on glass, carrier preparation, CMP die population and wafer to wafer bonding are discussed. Die to wafe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f1502b1367a490a60f183dde3dd5130
https://doi.org/10.1109/ectc32696.2021.00325
https://doi.org/10.1109/ectc32696.2021.00325