Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Doug Mitchell"'
Publikováno v:
PLoS ONE, Vol 11, Iss 12, p e0168330 (2016)
To test the hypotheses that community-dwelling veterans with spinal cord injury (SCI) who receive the Wheelchair Skills Training Program (WSTP) in their own environments significantly improve their manual wheelchair-skills capacity, retain those impr
Externí odkaz:
https://doaj.org/article/2d55aa774c0a42fe94325a269435175c
Autor:
Moderators: Rod D. Roscoe, Doug Mitchell, Angela Yoo, Claudia Ziegler Acemyan, Panelists: Karen Jacobs, Michelle M. Robertson, Organizers
Publikováno v:
Proceedings of the Human Factors and Ergonomics Society Annual Meeting. 64:555-558
Societal impact refers to the influence of research on economic, environmental, cultural, and social outcomes that extend beyond the scientific sphere. In 2018, the Human Factors and Ergonomic Society launched the Societal Impact Committee to mindful
Publikováno v:
International Oil Spill Conference Proceedings. 2021
Tier II/III SMART protocol for dispersant use requires placing fluorometers in the water and towing them under a slick by boat. To protect the health of SMART teams, boats typically remain at least 2 miles away from slicks during aerial dispersant tr
Autor:
Yap Weng Foong, Doug Mitchell, Tony Gong, Scott M. Hayes, Michael B. Vincent, Jason R. Wright
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001458-001485
Recent development efforts for fan-out wafer level packaging (FO-WLP) have focused on system-in-package (SiP) solutions using both 2D and 3D packaging structures. Creating connections between the various elements of the system is one of the critical
Autor:
Doug Mitchell, Jason R. Wright, Zhiwei Gong, Alan J. Magnus, Navjot Chhabra, Michael B. Vincent, Scott M. Hayes, Yap Weng Foong
Publikováno v:
International Symposium on Microelectronics. 2013:000447-000451
Fan-out wafer level packaging (FO-WLP) has shifted from standard single die, single sided package to more advanced packages for System-in-Package (SiP) and 3D applications. Freescale's FO-WLP, Redistributed Chip Package (RCP), has enabled Freescale t
Autor:
Navjot Chhabra, Michael B. Vincent, Scott M. Hayes, Trung Duong, Doug Mitchell, Zhiwei Gong, Jason R. Wright
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:002374-002398
Fan-out wafer level packaging (FO-WLP) has become prevalent in past two years as a package option with large number of pin count. As the result of early development, the single die packages with single-sided redistribution has reached the maturity to
Autor:
Dominic Koey, George R. Leal, Gao Wei, Tony Gong, Scott M. Hayes, Jason R. Wright, Tony Vessa, Doug Mitchell
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001105-001125
The start-up of the 300mm RCP prototype production line using automated tools was challenged by significant differences in tool sets when compared to the manual and semi-automatic lab based equipment used to develop the baseline RCP fabrication proce
Publikováno v:
Integrative Cancer Therapies. 8:283-287
Photodynamic therapy (PDT) is an established therapeutic method, first approved by the FDA for certain kinds of cancer in 1998. There are also increasing data to show that a related procedure, sonodynamic therapy (SDT), is a promising new modality fo
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 11:280-284
Publikováno v:
Cuadernos.info. :10-20
En este articulo, cuatro destacados profesionales de los medios describen como se elabora la pauta informativa en prensa, radio, television e internet. Felipe Aldunate, editor de AmericaEconomia; Carola Urrejola, conductora de En Boca de Todos de Can