Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Doug Loy"'
Publikováno v:
Microelectronic Engineering. 88:2852-2856
For fabrication of flexible electronics using standard microelectronics toolsets, a temporary bond–debond method has been developed that requires minimization of the distortion of bonded flexible substrate and bow of bonded system (flexible substra
Autor:
E. J. Bawolek, Korhan Kaftanoglu, Sameer M. Venugopal, Michael Marrs, David R. Allee, Doug Loy, Aritra Dey
Publikováno v:
Journal of Display Technology. 7:339-343
Mixed-oxide thin-film transistors (TFTs) have been extensively researched due to their improved stability under electrical bias stress compared to amorphous-silicon TFTs. However, there are many challenges before they can reach the manufacturing stag
Publikováno v:
Journal of Non-Crystalline Solids. 357:1114-1117
Hydrogen plays a critical role in the passivation of dangling bonds in hydrogenated amorphous silicon (a-Si:H) to enable acceptable semiconducting characteristics during operation in devices. Low temperature processing enables fabrication of high per
Autor:
Shawn M. O'Rourke, James C. Sturm, David R. Allee, Kunigunde H. Cherenack, A.Z. Kattamis, I-Chun Cheng, Sigurd Wagner, Sameer M. Venugopal, Doug Loy, B. Hekmatshoar, Ke Long
Publikováno v:
Journal of Display Technology. 3:304-308
The transition of thin-film transistor (TFT) backplanes from rigid plate glass to flexible substrates requires the development of a generic TFT backplane technology on a clear plastic substrate. To be sufficiently stable under bias stress, amorphous-
Publikováno v:
Journal of Applied Physics. 108:114917
Manufacturing of microelectronics on flexible substrates is challenged by difficulties in maintaining alignment and conformity of the substrate through deposition, patterning, and etch processes. To address these difficulties, a temporary bond-debond
Publikováno v:
Journal of the Society for Information Display. 18:884
— A processing technology based upon a temporary bond—debond approach has been developed that enables direct fabrication of high-performance electronic devices on flexible substrates. This technique facilitates processing of flexible plastic and
Autor:
E. J. Bawolek, Michael Hack, Yong Kyun Lee, Shawn M. O'Rourke, Doug Loy, Curt Moyer, Julie J. Brown, David C. Morton, Eric Forsythe, Nick Colaneri, Mark Richards, Kamala Rajan, Cynthia Bell, Jeff Silvernail, Sameer M. Venugopal, Michael Marrs, Jann Kaminski, Ruiqing Ma, Scott K. Ageno
Publikováno v:
SID Symposium Digest of Technical Papers. 40:988
A low temperature, 180 °C, amorphous Si (a-Si:H) process on bonded polyethylene naphthalate substrates is discussed and a 4.1-inch QVGA active matrix (AM) phosphorescent OLED display is demonstrated. The n-channel thin-film transistors (TFTs) exhibi
Autor:
Marie Lowe, Amanuel Gebrebrhan, Scott K. Ageno, Shawn M. O'Rourke, Michael Marrs, Ahila Krishnamoorthy, Deborah Yellowaga, Doug Loy, Peter Smith, Richard Spear, Hai Bien, Jeff Dailey, Mehari Stifanos
Publikováno v:
SID Symposium Digest of Technical Papers. 39:140
Organosiloxane based spin on planarizing dielectrics (PTS-E and PTS-R) were developed for application in flat panel displays as a replacement to conformal chemical vapor deposited SiNx. Here we demonstrate the successful use of siloxane-based materia