Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Doug Day"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:836-844
Thermal compression bonding (TCB) involves three technology themes: high-speed and high-accuracy motion, substrate–die planarity, and stability for long production runs. We will propose solutions for each of these themes. For high-speed and high-ac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d91c4b84c6f02081cd53ae4556a58cfe
https://doi.org/10.1109/tcpmt.2019.2908421
https://doi.org/10.1109/tcpmt.2019.2908421
Autor:
Hiromi Shibahara, Maeda Toru, Tatsuo Nagamatsu, Hidekazu Yagi, Daisuke Tani, Ryoji Kojima, Junichi Kaneko, Tetsuya Utano, Doug Day, Watanabe Osamu, Sung Chenhsiu, Nakamura Tomonori, Mori Daichi
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
We demonstrate a dynamic characteristics evaluation system using a flip chip bonder for non-conductive film (NCF) and its applications for analysis and design of the processes. Under thermally transient conditions, quasi-static viscosity of NCF which
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca271873aede1527cc9b5ed4405fe9cc
https://doi.org/10.1109/ectc.2019.00297
https://doi.org/10.1109/ectc.2019.00297
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
A new, highly productive and accurate thermal compression bonder is presented. Overcoming the disparity between productivity and accuracy, we propose a multi-table and multi-bond head system utilizing gantries, including: a pipeline system to decreas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fda3bfe0c8609285e7d6e4becf31eee9
https://doi.org/10.1109/ectc.2018.00066
https://doi.org/10.1109/ectc.2018.00066
Publikováno v:
SIGGRAPH Talks
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86e33620fe8a2afaecad27ef0212c2e7
https://doi.org/10.1145/2614106.2614188
https://doi.org/10.1145/2614106.2614188
Akademický článek
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