Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Doo-Myun Lee"'
Publikováno v:
IFIP Advances in Information and Communication Technology
14th IFIP International Conference on Product Lifecycle Management (PLM)
14th IFIP International Conference on Product Lifecycle Management (PLM), Jul 2017, Seville, Spain. pp.162-173, ⟨10.1007/978-3-319-72905-3_15⟩
Product Lifecycle Management and the Industry of the Future ISBN: 9783319729046
PLM
14th IFIP International Conference on Product Lifecycle Management (PLM)
14th IFIP International Conference on Product Lifecycle Management (PLM), Jul 2017, Seville, Spain. pp.162-173, ⟨10.1007/978-3-319-72905-3_15⟩
Product Lifecycle Management and the Industry of the Future ISBN: 9783319729046
PLM
Part 3: PLM and Process Simulation; International audience; This research aims to build an integrated framework to analyze the production flow efficiency (in terms of worker utilization) of the manual machine component assembly process. Problems rela
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a974074dffc5276d4d7aa23cfad0065f
https://hal.inria.fr/hal-01764216/document
https://hal.inria.fr/hal-01764216/document
Publikováno v:
Journal of Japan Institute of Light Metals. 45:391-396
AZ91D magnesium alloy machined chips were extruded at various extrusion conditions such as extrusion ratio and die angle. The mechanical properties and microstructure of the extruded chips were studied in order to find optimum extrusion parameters. T
The p-type Bi0.5Sb1.5Te3 compound doped with 4.0 wt% Te was fabricated by the hot extrusion at the temperature range of 300–510 °C under an extrusion ratio of 20:1 and a ram speed of 5 cm/min. The microstructure of the compound was investigated by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::376ec8b5299b0e5a530043e689badca4
https://doi.org/10.1016/b978-044482548-3/50089-5
https://doi.org/10.1016/b978-044482548-3/50089-5
The p–type Bi0.5Sb1.5Te3 compound doped with 4.0 wt% Te was fabricated by the hot pressing at the temperature range 380 to 440 °C under 200 MPa in Ar. The microstructure and thermoelectric properties of the compound were investigated. Optical micr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96d524bd22d7062cddc5a28aad9b676a
https://doi.org/10.1016/b978-044482548-3/50088-3
https://doi.org/10.1016/b978-044482548-3/50088-3
Conference
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