Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Donna-Ruth Yost"'
Autor:
Melissa A. Smith, Paul Miller, Corey Stull, Eric Holihan, James C. McRae, Gianni Pinelli, Bradley Duncan, Livia M. Racz, Donna-Ruth Yost
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:908-916
Wafer-scale heterogeneous integration provides a viable pathway for the development of highly capable microsystems. However, it remains challenging to integrate die-and wafer-level components with a high-density interconnects while minimizing the sys
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f6ac85ce4ecf0e9572114caee6cfa4b
https://doi.org/10.1109/tcpmt.2020.2984953
https://doi.org/10.1109/tcpmt.2020.2984953
Autor:
Mark A. Eriksson, Robert McDermott, Nathan Holman, Rabi Das, William D. Oliver, Danna Rosenberg, Jonilyn Yoder, Donna-Ruth Yost
Publikováno v:
npj Quantum Information, Vol 7, Iss 1, Pp 1-7 (2021)
One major challenge to scaling quantum dot qubits is the dense wiring requirements, making it difficult to envision fabricating large 2D arrays of nearest-neighbor-coupled qubits necessary for error correction. We describe a method to ameliorate this
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::08c41b03217fdb8cf9a209ae623c62dc
https://doi.org/10.1038/s41534-021-00469-0
https://doi.org/10.1038/s41534-021-00469-0
Autor:
Rabindra N. Das, Donna-Ruth Yost, David Conway, Danna Rosenberg, William D. Oliver, Wayne Woods, Jonilyn Yoder, David Kim, S. J. Weber, Justin Mallek, Gregory Calusine, Mollie Schwartz
Publikováno v:
arXiv
© 2000-2012 IEEE. Quantum processing has the potential to transform the computing landscape by enabling efficient solutions to problems that are intractable using classical processors. The field was sparked by a suggestion from physicist Richard Fey
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::260f419af50e41fad0a4a7d000a9d31c
https://hdl.handle.net/1721.1/135988
https://hdl.handle.net/1721.1/135988
Autor:
Richard J. Molnar, Donna-Ruth Yost, Corey Stull, Ryan C. Johnson, Tomas Palacios, C. Galbraith, Matthew T. Cook, Beijia Zhang, C. Chen, WeiLin Hu, Craig L. Keast, Jeffrey Knechtl, Jeffrey W. Daulton, Joshua Perozek, Jeffrey S. Herd, Gianni Pinelli, Shireen Warnock
Publikováno v:
2020 IEEE/MTT-S International Microwave Symposium (IMS).
In this paper we present a fully CMOS-compatible fabrication process for GaN-on-Si monolithic microwave integrated circuits (MMICs) on 200-mm-diameter wafers. This process also enables wafer-level 3D integration of GaN MMICs with Si CMOS circuits to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2bf05b1f91dda23a808c722b49f52436
https://doi.org/10.1109/ims30576.2020.9224061
https://doi.org/10.1109/ims30576.2020.9224061
Autor:
Danna Rosenberg, Livia M. Racz, Jason J. Plant, Mollie Schwartz, Donna Ruth-Yost, Rabi Das, Greg Calusine, Bethany M. Niedzielski, Alexander Melville, William D. Oliver, David Kim, Jonilyn Yoder
Publikováno v:
arXiv
© 2019 IEEE. As designs for superconducting qubits become more complex, 3D integration of two or more vertically bonded chips will become necessary to enable increased density and connectivity. Precise control of the spacing between these chips is r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::35843c47d96e4f95d69e0e3f8717aa8b
https://hdl.handle.net/1721.1/137663
https://hdl.handle.net/1721.1/137663
Autor:
Greg Calusine, Danna Rosenberg, Donna-Ruth Yost, Bethany Niedzielski, Jonilyn Yoder, Evan Golden, Rabindra N. Das, Andrew J. Kerman, Alexander Melville, Mollie Schwartz, William D. Oliver, Daekeun Kim, Justin Mallek, Corey Stull, Matthew T. Cook, Alexandra Day, Wayne Woods
Publikováno v:
npj Quantum Information, Vol 6, Iss 1, Pp 1-7 (2020)
As superconducting qubit circuits become more complex, addressing a large array of qubits becomes a challenging engineering problem. Dense arrays of qubits benefit from, and may require, access via the third dimension to alleviate interconnect crowdi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8b157a484b1b2ce26132bbf4370691e3
Autor:
Andrew J. Kerman, S. J. Weber, Fei Yan, David Hover, Gabriel Samach, Simon Gustavsson, Philip Krantz, Alexander Melville, Jonilyn Yoder, David Kim, Livia M. Racz, Rabindra N. Das, Danna Rosenberg, Donna-Ruth Yost, William D. Oliver
Publikováno v:
npj Quantum Information, Vol 3, Iss 1, Pp 1-5 (2017)
As the field of quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::eb1a1b38dd3e4f92859cf1acb5d39d16
https://doi.org/10.1038/s41534-017-0044-0
https://doi.org/10.1038/s41534-017-0044-0