Zobrazeno 1 - 10 of 30 pro vyhledávání: '"Dongwoo Park"'
1
Korean VP-Ellipsis and a Derivational Approach to Ellipsis
Autor: Dongwoo Park
Publikováno v: Linguistic Inquiry. :1-39
This article argues that under the assumption that the verbal domain contains VoiceP, distinct from vP, Korean has VP-ellipsis, where the morpheme ha, which lacks semantic content, is located in v in the surface representation and its complement VP
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a8fb1ab1e56e2cf579de485bc432abf6
https://doi.org/10.1162/ling_a_00486
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7
The minimum convex container of two convex polytopes under translations
Autor: Sang Won Bae, Otfried Cheong, Chan-Su Shin, Dongwoo Park, Judit Abardia, Hee-Kap Ahn, Susanna Dann
Publikováno v: Computational Geometry. 77:40-50
Given two convex d-polytopes P and Q in R d for d ⩾ 3 , we study the problem of bundling P and Q in a smallest convex container. More precisely, our problem asks to find a minimum convex set containing P and a translate of Q that do not properly ov
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::2cd4d834e9178f685a63d57ff8bfde94
https://doi.org/10.1016/j.comgeo.2018.02.004
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8
The Existence of Failed Agreement: Evidence from English List-Existentials
Autor: Dongwoo Park
Publikováno v: Language & Information Society. 36:83-108
This paper aims to propose a structure of English list-existentials, an understudied type of expletive there-constructions, and argue the existence of failed agreement, proposed by Preminger(2014), by using English list-existentials. These constructi
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a5dc3ea34bc13b953a2f5ccc283fbc74
https://doi.org/10.29211/soli.2019.36..003
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10
A New FOWLP Platform for Hybrid Optical Packaging - Demonstration on 100Gbps Transceiver
Autor: David Dongwoo Park, Sukyoon Oh, Seungman Han, Yoonyoung Bae, Seong-Wook Choi, Young June Park
Publikováno v: OFC
The Fan Out Wafer Level Packaging, widely used in the silicon semiconductor system, is introduced for all-in-one hybrid optical package with small form factor, potentially higher performance, and expendability to on-board/co-packaged optical intercon
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1ccb55b5398390ebc5e5e17a7f627fb2
https://doi.org/10.1364/ofc.2021.m2b.1
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