Zobrazeno 1 - 10
of 68
pro vyhledávání: '"Dongming He"'
Autor:
Yiting Sun, Yinglong Zhang, Yibo Guo, Dongming He, Wanlin Xu, Wei Fang, Chenping Zhang, Yi Zuo, Zhen Zhang
Publikováno v:
Journal of Nanobiotechnology, Vol 22, Iss 1, Pp 1-16 (2024)
Abstract Biomaterials can modulate the local immune microenvironments to promote peripheral nerve regeneration. Inspired by the spatial orderly distribution and endogenous electric field of nerve fibers, we aimed to investigate the synergistic effect
Externí odkaz:
https://doaj.org/article/c62a009a641143cab4d7000b110df034
Autor:
Yiting Sun, Hongjian Zhang, Yu Zhang, Zheqi Liu, Dongming He, Wanlin Xu, Siyi Li, Chenping Zhang, Zhen Zhang
Publikováno v:
Bioactive Materials, Vol 28, Iss , Pp 227-242 (2023)
Biomaterials can modulate the local immune and repair-supportive microenvironments to promote peripheral nerve regeneration. Inorganic bioceramics have been widely used for regulating tissue regeneration and local immune response. However, little is
Externí odkaz:
https://doaj.org/article/4df30a35006647b2aed4b29149eb5bf5
Publikováno v:
Asian Journal of Surgery, Vol 46, Iss 12, Pp 5648-5649 (2023)
Externí odkaz:
https://doaj.org/article/0694998bc78142d5930a1b67d812a372
Autor:
Jinghui Guo, Yong Wu, Zhiyong Gong, Xixi Chen, Fei Cao, Shashwati Kala, Zhihai Qiu, Xinyi Zhao, Jun‐jiang Chen, Dongming He, Taiheng Chen, Rui Zeng, Jiejun Zhu, Kin Fung Wong, Suresh Murugappan, Ting Zhu, Quanxiang Xian, Xuandi Hou, Ye Chun Ruan, Baojun Li, Yu Chao Li, Yao Zhang, Lei Sun
Publikováno v:
Advanced Science, Vol 9, Iss 12, Pp n/a-n/a (2022)
Abstract Optogenetics has become a widely used technique in neuroscience research, capable of controlling neuronal activity with high spatiotemporal precision and cell‐type specificity. Expressing exogenous opsins in the selected cells can induce n
Externí odkaz:
https://doaj.org/article/5eb36057b9c545edbd72b86bb9c8ebc0
Many of the proteins that contain the amino acid selenocysteine (Sec) are required for optimal defense against cellular stress. As such, one might expect selenoprotein synthesis to persist or be induced upon cellular insult. Because Sec is incorporat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c673c67ded11b004693b3ac20da4a8b
https://doi.org/10.1101/2023.05.12.540527
https://doi.org/10.1101/2023.05.12.540527
Autor:
Jiejun Zhu, Quanxiang Xian, Xuandi Hou, Kin Fung Wong, Tingting Zhu, Zihao Chen, Dongming He, Shashwati Kala, Suresh Murugappan, Jianing Jing, Yong Wu, Xinyi Zhao, Danni Li, Jinghui Guo, Zhihai Qiu, Lei Sun
Publikováno v:
Proceedings of the National Academy of Sciences. 120
Transcranial low-intensity ultrasound is a promising neuromodulation modality, with the advantages of noninvasiveness, deep penetration, and high spatiotemporal accuracy. However, the underlying biological mechanism of ultrasonic neuromodulation rema
Periosteum has shown potential as an effective barrier membrane for guided bone regeneration (GBR). However, if recognized as a “foreign body”, insertion of a barrier membrane in GBR treatment will inevitably alter the local immune microenvironme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e1e018226cdda4d74b4b08805c57b97
https://doi.org/10.22541/au.167750464.45514003/v1
https://doi.org/10.22541/au.167750464.45514003/v1
Publikováno v:
FEBS Letters. 595:2208-2220
Previous studies have suggested that phosphorylation of translation elongation factor 1A (eEF1A) can alter its function, and large-scale phospho-proteomic analyses in Saccharomyces cerevisiae have identified 14 eEF1A residues phosphorylated under var
Publikováno v:
2021 4th World Conference on Mechanical Engineering and Intelligent Manufacturing (WCMEIM).
Autor:
Ahmer Syed, Mark Schwarz, Dongming He, Wei Zhao, Xuefeng Zhang, Lily Zhao, Wei Wang, Mark Nakamoto
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
With the increasing requirement for advanced technology nodes in high-performance devices, low-K (LK), ultralow-K (ULK) and extreme low K (ELK) dielectric materials have been integrated with copper pillar bumps in Back-End-of-Line (BEOL) interconnect