Zobrazeno 1 - 10
of 35
pro vyhledávání: '"Donghee Cho"'
Autor:
Ashenafi Milkesa, Tesfaye Rufael, Getachew Kinfe, Redeat Belaineh, Abdella Bulbula, Donghee Cho, Mohammed Naimuddin, Teshale Sori, Hunduma Dinka
Publikováno v:
PLoS Neglected Tropical Diseases, Vol 18, Iss 7, p e0012287 (2024)
BackgroundCoxiella burnetii is causing infections in both humans and animals, resulting in Q fever and Coxiellosis, respectively. Information on the occurrence of C. burnetii infection is scarce in Ethiopia. This study estimated the sero-prevalence o
Externí odkaz:
https://doaj.org/article/1585cc0121204a1d9f5bc650835a0404
Publikováno v:
IEEE Journal of Solid-State Circuits. 58:720-731
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e08dcf1cf372b7c5f842ba6181024657
https://doi.org/10.1109/jssc.2022.3230424
https://doi.org/10.1109/jssc.2022.3230424
Publikováno v:
2023 IEEE Custom Integrated Circuits Conference (CICC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::048509fc855501f3cc353075fdba30e9
https://doi.org/10.1109/cicc57935.2023.10121282
https://doi.org/10.1109/cicc57935.2023.10121282
Autor:
Phan Dang Hung, Hongseok Shin, Yechan Park, Nguyen Kim Hoang, Donghee Cho, Sohmyung Ha, Chul Kim, Minkyu Je
Publikováno v:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f83be1fda2985eac214f38a480868d3b
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830494
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830494
Autor:
Gemechis Waktole, Donghee Cho
Malaria is one of the most important infectious diseases that threaten half of the world’s population. Ethiopia is among countries with a high malaria burden. Plasmodium falciparum is the most common (64%) cause of malaria in Ethiopia while P. viva
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2d3fe1bc2a2d4a678de09297dc0ecee
https://doi.org/10.21203/rs.3.rs-1473028/v2
https://doi.org/10.21203/rs.3.rs-1473028/v2
Publikováno v:
2022 IEEE Custom Integrated Circuits Conference (CICC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9b3ebda1e8dcc04a8a0483ea6a9106b
https://doi.org/10.1109/cicc53496.2022.9772861
https://doi.org/10.1109/cicc53496.2022.9772861
Autor:
Sein Oh, Donghee Cho, Chul Kim, Minkyu Je, Hongseok Shin, Hyunwoo Park, Sohmyung Ha, Taeju Lee
Publikováno v:
ESSCIRC
In this paper, we present a load-current-regulating OLED driver for wearable light therapy devices. The driver is based on a single-stage DC-DC hybrid step-up converter architecture achieving high efficiency at a high conversion ratio. The hybrid top
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5cc0245e429b06ad705e57aa098e3cdd
https://doi.org/10.1109/esscirc53450.2021.9567889
https://doi.org/10.1109/esscirc53450.2021.9567889
Autor:
Minkyu Je, Chul Kim, Unbong Lee, Doojin Jang, Jinuk Kim, Donghee Cho, Yoontae Jung, Hongseok Shin, Hyungjoo Cho, Sohmyung Ha
Publikováno v:
IEEE Solid-State Circuits Letters. 3:530-533
This letter presents a high-gain energy-efficient three-stage amplifier, which employs buffering-based pole relocation and dual-path structure. The proposed design does not rely on the introduction of compensation zero and preserves the unity-gain ba
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1bef588bb3719d857ef56f98298af1a1
https://doi.org/10.1109/lssc.2020.3036496
https://doi.org/10.1109/lssc.2020.3036496
Publikováno v:
Animal Gene. 24:200126
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32f10494bd0efdb2b3c6bd9ebedd10a8
https://doi.org/10.1016/j.angen.2022.200126
https://doi.org/10.1016/j.angen.2022.200126
Publikováno v:
2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Pattern analysis of wafer maps in semiconductor manufacturing is critical for failure analysis aspects or activities that increase yield. As deep learning becomes more popular than ever, research on the wafer map classification is active. However, mo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13b69140ac566e66630cfc7af60ff46c
https://doi.org/10.1109/ipfa49335.2020.9260877
https://doi.org/10.1109/ipfa49335.2020.9260877