Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Donggap Shin"'
Autor:
Wooyoung Kim, Seung Ho Han, Yongin Lee, Donggap Shin, Wonyoung Choi, Jiwon Moon, Kyeongbin Lim, BumKi Moon, Minwoo Daniel Rhee
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Autor:
Seung Ho Hahn, Wooyoung Kim, Donggap Shin, Yongin Lee, Wonyoung Choi, Bumki Moon, Kyeonbin Lim, Minwoo Rhee
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).