Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Dong-su Ryu"'
Autor:
Jin Young Khim, Muhammad Hadhari Hazellah, HyeongIl Jeon, Kim Byong Jin, Weng Tuck Chim, Dong Su Ryu
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Most power packages still use a high-lead (Pb) solder paste because the high-Pb solder paste has the advantage of no re-melt during the printed circuit board (PCB) reflow process as well as good wettability and high reliability performance. There are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::adc500f3c082ea259ad044b8650f6b21
https://doi.org/10.1109/ectc.2019.00224
https://doi.org/10.1109/ectc.2019.00224
Autor:
Juhoon Yoon, Dong Su Ryu, Byong Jin Kim, YoungWoo Lee, DaeByoung Kang, GyuIck Jung, Jae Ung Lee, ChoongHoe Kim, EunNaRa Cho, JinYoung Khim, Sun-Joong Kim
Publikováno v:
Journal of the Microelectronics and Packaging Society. 23:43-48
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ad0223858f52cd4bd40eb123e986b51a
https://doi.org/10.6117/kmeps.2016.23.4.043
https://doi.org/10.6117/kmeps.2016.23.4.043
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
As the high demand of high power and high current in power discrete packages, products are applying the bigger die size but are limited by the same package footprint. The bigger die size requires bigger exposed pad(e-pad) size but limited by given fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3af851a1ad57336225239f2224771277
https://doi.org/10.1109/icept.2018.8480692
https://doi.org/10.1109/icept.2018.8480692
Autor:
Dong-Su Ryu, Seog-Weon Chang
Publikováno v:
Microelectronics Reliability. 45:611-622
We begin by examining the diverse connotations of the term quality. The desirable shape traced by the failure rate of the entire life of a good product, which might be called a hockey-stick line rather than a bathtub curve, is introduced. From the ho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4508009d953512940c1855b6a7a3823
https://doi.org/10.1016/j.microrel.2004.10.010
https://doi.org/10.1016/j.microrel.2004.10.010
Autor:
Seogweon Chang, Dong-Su Ryu
Publikováno v:
Key Engineering Materials. :1791-1798
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aa33e0de49fc5fb1e441c834958fbd6b
https://doi.org/10.4028/www.scientific.net/kem.270-273.1791
https://doi.org/10.4028/www.scientific.net/kem.270-273.1791
Publikováno v:
International Journal of Modern Physics B. 17:1408-1414
This paper presents an accelerated life test for embrittlement of natural rubber grommets. From the analyses of field samples, it is found that embrittlement is due to the decrease of plasticizer (zinc stearate for natural rubber) in the rubber. To e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5fbc809d1af653be4333a0cc8d906c0d
https://doi.org/10.1142/s0217979203019071
https://doi.org/10.1142/s0217979203019071
Publikováno v:
International Journal of Modern Physics B. 17:1254-1260
Failures of NTC thermistor are analyzed. Visual inspection, electrical parameter test, non-destructive test, and destructive physical analysis were performed on the field samples to identify the root cause of failure. It was found that the predominan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::553e270f74b1532ff0692fb873062bdc
https://doi.org/10.1142/s0217979203018831
https://doi.org/10.1142/s0217979203018831
Publikováno v:
International Journal of Modern Physics B. 17:1318-1323
This paper presents the failure analysis and the reliability estimation of a multilayer ceramic chip capacitor. For the failed samples used in an automobile engine control unit, failure analysis was made to identify the root cause of failure and it w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ac52aa2973f19fd84a738ee5c2ef037
https://doi.org/10.1142/s0217979203018934
https://doi.org/10.1142/s0217979203018934
Publikováno v:
Advances in Electronic Materials & Packaging 2001 (Cat. No.01EX506); 2001, p286-295, 10p
Publikováno v:
Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).
This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure modes and failure mechanisms were studied in two ways in order to estimate component life and failure rate. The causes of fai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7c603c3d20f8a83a00da16024bc7ce6
https://doi.org/10.1109/emap.2001.983999
https://doi.org/10.1109/emap.2001.983999