Výsledky vyhledávání - "Dong-Hak Lee"

Citizens’ Preference and Perception of Street Trees of Main Boulevards in Busan, South Korea

Autor: Sang Seup Kim, Dong Hak Lee, Yeol Choi, Jae-Song Lee

Publikováno v: Sustainability
Volume 13
Issue 6
Sustainability, Vol 13, Iss 3141, p 3141 (2021)

Street tree species are selected mainly based on functional utility. This selection practice results in effective management. If the value of street trees as perceived by citizens is added to the existing selection criteria, satisfaction will be impr

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::66fbe7e40c3fdaba816759308225dedc

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Improving after-etch overlay performance using high-density in-device metrology in DRAM manufacturing

Autor: Seung-Woo Koo, Jung-Il Hwang, Hyun-Sok Kim, Rizvi Rahman, Kwang-Young Hu, Dong-Jin Lee, Min-Shik Kim, Raheleh Pishkari, In-Ho Joo, Dong-Hak Lee, Jae-Wuk Ju, Allwyn Boustheen, Ik-Hyun Jeong, Marc Hauptmann, Paul Böcker, Kang-San Lee, Kang-Min Lee, Cees Lambregts, Young-Sik Kim

Publikováno v: Metrology, Inspection, and Process Control for Microlithography XXXIV.

In advanced DRAM semiconductor manufacturing, there is a need to reduce the overlay fingerprints. Reducing on device fingerprints with very high spatial frequency remains one of the bottlenecks to achieve sub-2nm on device overlay. After-etch device

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a8882fbb7d4f4224fc01c899081e8b10
https://doi.org/10.1117/12.2552028

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Measuring after etch overlay and characterizing tilt fingerprints in multi-tier 3D-NAND structures

Autor: Jun-Yeob Kim, Dongyoung Lee, Sangjun Han, Aileen Soco, Nang-Lyeom Oh, Chanha Park, Tjitte Nooitgedagt, Dong-Hak Lee, Arno van Leest, Honggoo Lee, Jaap Karssenberg, Mir Shahrjerdy

Publikováno v: Metrology, Inspection, and Process Control for Microlithography XXXIII.

In next generation 3D-NAND devices, accurately determining after-etch overlay for the multi-layer stack is a major challenge. This is especially the case for the multi-tier 3D-NAND structures, where the overlay of the channel holes is an important pe

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::0f9f52b2fdc4cec90bd1e0ff7c1730fe
https://doi.org/10.1117/12.2515299

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