Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Dong Phuong NT"'
Autor:
Toan NS; University of Technology and Education, The University of Danang, 48 Cao Thang, Danang, Viet Nam. Electronic address: nstoan@ute.udn.vn., Hanh DH; University of Technology and Education, The University of Danang, 48 Cao Thang, Danang, Viet Nam. Electronic address: dhhanh@ute.udn.vn., Dong Phuong NT; University of Technology and Education, The University of Danang, 48 Cao Thang, Danang, Viet Nam. Electronic address: ntdphuong@ute.udn.vn., Thuy PT; Faculty of Agronomy, Vietnam National University of Agriculture, Trau Quy, Gia Lam, Ha Noi, Viet Nam. Electronic address: thuynh@vnua.edu.vn., Dong PD; Faculty of Environmental Engineering, National University of Civil Engineering, 55 Giai Phong Street, Hai Ba Trung District, Hanoi, 100803, Viet Nam. Electronic address: dongpd@nuce.edu.vn., Gia NT; Department of Environmental and Occupational Health, College of Medicine and Pharmacy, Hue University, Hue City, 530000, Viet Nam. Electronic address: gianguyen175@hueuni.edu.vn., Tam LD; Planning & Coordination Division, Vietnam-Korea Institute of Science and Technology, Ministry of Science and Technology, Viet Nam. Electronic address: ductamle.vkist@gmail.com., Thu TTN; University of Technology and Education, The University of Danang, 48 Cao Thang, Danang, Viet Nam. Electronic address: ttnthu@ute.udn.vn., Thanh DTV; University of Technology and Education, The University of Danang, 48 Cao Thang, Danang, Viet Nam. Electronic address: dtvthanh@ute.udn.vn., Khoo KS; Faculty of Applied Sciences, UCSI University, No. 1, Jalan Menara Gading, UCSI Heights, 56000, Cheras, Kuala Lumpur, Malaysia. Electronic address: kuanshiong.khoo@hotmail.com., Show PL; Department of Chemical and Environmental Engineering, Faculty of Science and Engineering, University of Nottingham Malaysia, Jalan Broga, 43500, Semenyih, Selangor Darul Ehsan, Malaysia. Electronic address: PauLoke.Show@nottingham.edu.my.
Publikováno v:
Chemosphere [Chemosphere] 2022 May; Vol. 294, pp. 133596. Date of Electronic Publication: 2022 Jan 11.