Zobrazeno 1 - 10 of 20 pro vyhledávání: '"Dong Ok Kwak"'
1
Novel method of wafer-level and package-level process simulation for warpage optimization of 2.5D TSV
Autor: Jong Pa Hong, Su Chang Lee, Soohyun Nam, Sun woo Han, Park Yu-Kyung, Jongho Lee, Sang kun O, Dong Ok Kwak
Publikováno v: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
2.5D IC packages are typically produced through Chip on Wafer (CoW) or Chip on Substrate (CoS) processes. Among these, 2.5D processing involves bonding the interposer chip and ASIC chip perpendicularly in sequence to the substrate for 2.5D package pr
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::f762aa2b6486a8430d3507ea7cbc8279
https://doi.org/10.1109/ectc32696.2021.00242
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3
Warpage Simulation of a Multilayer Printed Circuit Board and Microelectronic Package Using the Anisotropic Viscoelastic Shell Modeling Technique That Considers the Initial Warpage
Autor: Dong-Ok Kwak, Hak-Sung Kim, Sung Jun Joo, Do-Hyoung Kim
Publikováno v: IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:1667-1676
In this paper, the warpage simulation of a high-density multilayer printed circuit board (PCB) for solid-state disk drive (SSD) and microelectronic package was performed using the anisotropic viscoelastic shell modeling technique. The thermomechanica
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::61dbd2ffb48a074da407bc7efd09518b
https://doi.org/10.1109/tcpmt.2016.2612637
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5
Evaluation about Solder-IMC Crack of Fine Pitch BGA Package
Autor: Taeho Kang, Ara Lee, Dong-Ok Kwak, Jaewoo Jeong
Publikováno v: International Symposium on Microelectronics. 2015:000147-000150
FBGA is widely adopted as AP and memory package for mobile devices such as a smart phone and a smart watch. FBGA is attached to PCB assembly during SMT process. Double side SMT is preferred to increase the battery area for slim design and long life o
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::762cff73bef729e3402a41fb5c160beb
https://doi.org/10.4071/isom-2015-tp54
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6
Finite element contact analysis on a horn-holder assembly for wire bonding
Autor: Jae Ok Kim, Geun Sik Ahn, Yung Joon Kim, Dong Ok Kwak, Seong Woon Booh, Changsoo Jang
Publikováno v: IEEE Transactions on Electronics Packaging Manufacturing. 26:46-53
The joint structure of a transducer horn-holder assembly for a wire bonder was examined through finite element contact analysis. Three-dimensional modeling and analysis was carried out to survey the internal physics of this structure and to verify th
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::3bc01ec44c19d6634599e3f139ad8b34
https://doi.org/10.1109/tepm.2003.812999
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7
Contact Analysis on a Born-Holder Assembly for Wire Bonding
Autor: Dong-Ok Kwak, Geun-Sik Ahn, Seong-Woon Boo, Young-Joon Kim, Changsoo Jang
Publikováno v: Transactions of the Korean Society of Mechanical Engineers A. 26:2008-2017
Joint structure of a transducer horn-holder assembly fur a wire bonder was examined through FEM contact analysis. A three dimensional modeling and analysis was carried out to survey the internal physics of this structure and to prove the accuracy of
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ab12bbb4b9e55bda842a9053c38d76e3
https://doi.org/10.3795/ksme-a.2002.26.10.2008
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8
Bi-directional homogenization equivalent modeling for the prediction of thermo-mechanical properties of a multi-layered printed circuit board (PCB)
Autor: Sung Jun Joo, Do-Hyoung Kim, Buhm Park, Hak-Sung Kim, Junhong Park, Dong-Ok Kwak
Publikováno v: Journal of Micromechanics and Microengineering. 26:045006
Warpage of multi-layered printed circuit boards (PCB) during the reflow process is a serious problem which affects the reliability of solder ball connections between the PCB and the mounted semi-conductor packages in electronic devices. It is essenti
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::58cbde6c5d12cd105e0fdaff94308253
https://doi.org/10.1088/0960-1317/26/4/045006
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9
Development of Reliability Verification System for Robust Package Design
Autor: Kuyoung Kim, Jeong-Yeol Kim, Joon-young Oh, Dong-Kil Shin, Hyung-Gil Baek, Young-Hee Song, Dong-Ok Kwak
Publikováno v: 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
To achieve design for reliability (DFR), a reliability verification system (RVS) was developed. Package level and board level reliabilities were predicted by the developed system automatically and the design for six sigma (DFSS) was achieved. Process
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1f259316ca5e6be85fbd067f41eb1f4b
https://doi.org/10.1109/esime.2007.360020
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10
Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards
Autor: Sung Jun Joo, Hak-Sung Kim, Dong-Ok Kwak, Do-Hyoung Kim
Publikováno v: Journal of Micromechanics and Microengineering. 25:105016
In this study, the warpage simulation of a multi-layer printed circuit board (PCB) was performed as a function of various copper (Cu) patterns/photoimageable solder resist (PSR) composite patterns and their anisotropic viscoelastic properties. The th
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::de106f1977243705f1a41f5105b5f463
https://doi.org/10.1088/0960-1317/25/10/105016
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