Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Donald W. Henderson"'
Publikováno v:
Journal of Electronic Materials. 36:173-178
When near-eutectic Sn-Ag-Cu (SAC) alloys are used to make soldered ball-grid-array (BGA) assemblies, the grain size of the joints is very large. During thermomechanical cycling, the solder joint fatigue process is often initiated with recrystallizati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb71d637731ca1f712af205665f9312e
https://doi.org/10.1007/s11664-006-0048-6
https://doi.org/10.1007/s11664-006-0048-6
Autor:
Da-Yuan Shih, Donald W. Henderson, Sung K. Kang, Lynne Gignac, Donovan N. Leonard, Sungil Cho, Jin Yu
Publikováno v:
Journal of Electronic Materials. 35:479-485
The near-ternary eutectic Sn-Ag-Cu alloys have been identified as leading Pb-free solder candidates to replace Pb-bearing solders in microelectronic applications. However, recent investigations on the processing behavior and solder joints reliability
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f918d4d29df1c0d767b7dfe1c578463
https://doi.org/10.1007/bf02690535
https://doi.org/10.1007/bf02690535
Publikováno v:
IBM Journal of Research and Development. 49:607-620
The replacement of lead (Pb)-bearing solders used in the electronic industry with Pb-free solders will become a reality in the near future. Several promising Pb-free solders have recently been identified, including Sn-0.7Cu, Sn-3.5Ag, Sn-3.8Ag-0.7Cu,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1f73a4b553df6e4b2a3518097923b7f
https://doi.org/10.1147/rd.494.0607
https://doi.org/10.1147/rd.494.0607
Publikováno v:
Journal of Electronic Materials. 33:1545-1549
Electron backscatter diffraction and polarized light microscopy have been used to quantify the number of crystallographically independent β-Sn dendrites present in near-eutectic, ball grid array Sn-Ag-Cu (SAC) solder balls as a function of cooling r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f90df2f24d57f200437565a437faef0f
https://doi.org/10.1007/s11664-004-0096-8
https://doi.org/10.1007/s11664-004-0096-8
Autor:
Pekka Turpeinen, L.P. Lehman, Mattt A. Korhonen, Karl J. Puttlitz, Brian Bowman, Donald W. Henderson, George H. Thiel, Raymond C. Parkes, Tia-Marje K. Korhonen
Publikováno v:
Journal of Electronic Materials. 33:1581-1588
The deformation properties of near-eutectic Sn-Ag-Cu alloy were measured in temperatures ranging from −25 to 125°C, and down to strain rates of about 10×10−9. Results have been combined into a stress versus strain rate master curve. The measure
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e445ec529bd7db4cbc21200cd86d90c4
https://doi.org/10.1007/s11664-004-0101-2
https://doi.org/10.1007/s11664-004-0101-2
Autor:
Jin Yu, Donald W. Henderson, Da-Yuan Shih, Donovan N. Leonard, Sungil Cho, Timothy A. Gosselin, Won Kyoung Choi, Sung K. Kang
Publikováno v:
JOM. 56:34-38
As a result of extensive studies, nearternary-eutectic Sn-Ag-Cu (SAC) alloys have been identified as the leading lead-free solder candidates to replace lead-bearing solders for ball-grid array module assembly. However, recent studies revealed several
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a037d5c8304f03ce10a3e112d03a2cb
https://doi.org/10.1007/s11837-004-0108-4
https://doi.org/10.1007/s11837-004-0108-4
Autor:
Paul A. Lauro, Sung K. Kang, L.P. Lehman, Karl J. Puttlitz, T.M. Korhonen, David E. King, Charles C. Goldsmith, James John Woods, Da-Yuan Shih, Matt A. Korhonen, Jay Bartelo, Donald W. Henderson, Eric J. Cotts, Timothy A. Gosselin
Publikováno v:
Journal of Materials Research. 19:1608-1612
During the solidification of solder joints composed of near-eutectic Sn–Ag–Cu alloys, the Sn phase grows rapidly with a dendritic growth morphology, characterized by copious branching. Notwithstanding the complicated Sn growth topology, the Sn ph
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb007cb82be0f5d71a9ffe1d03f64500
https://doi.org/10.1557/jmr.2004.0222
https://doi.org/10.1557/jmr.2004.0222
Autor:
Karl J. Puttlitz, Paul A. Lauro, Donald W. Henderson, Timothy A. Gosselin, Da-Yuan Shih, Jay Bartelo, Won Kyoung Choi, Sung K. Kang, Tae K. Hwang, Steve R. Cain, Charles C. Goldsmith
Publikováno v:
MATERIALS TRANSACTIONS. 45:695-702
The electronic industry is making substantial progress toward a full transition to Pb-free soldering in the near future. At present, the leading candidate Pb-free solders are near-ternary eutectic Sn-Ag-Cu alloys. The electronic industry has begun to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::546053c8613327b41424d196ea8a1cd2
https://doi.org/10.2320/matertrans.45.695
https://doi.org/10.2320/matertrans.45.695
Autor:
Won-Kyoung Choi, Karl J. Puttlitz, Sung K. Kang, Timothy A. Gosselin, Charles C. Goldsmith, Amit K. Sarkhel, Da-Yuan Shih, Donald W. Henderson
Publikováno v:
Journal of Materials Research. 17:2775-2778
Near-ternary eutectic Sn–Ag–Cu alloys are leading candidates for Pb-free solders. These alloys have three solid phases: β–Sn, Ag3Sn, and Cu6Sn5. Starting from the fully liquid state in solidifying near-eutectic Sn–Ag–Cu alloys, the equilib
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f5581f616dda32da1b955e00e0d9f77
https://doi.org/10.1557/jmr.2002.0402
https://doi.org/10.1557/jmr.2002.0402
Autor:
Donald W. Henderson, Karl J. Puttlitz, D.-Y. Shih, M.J. Griffin, Myung-Jin Yim, Keith E. Fogel, Sung K. Kang, D.E. King, Amit K. Sarkhel, Timothy A. Gosselin, J.J. Konrad, Gerald G. Advocate, Charles C. Goldsmith, Paul A. Lauro
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 25:155-161
Recently, the research and development activities for replacing Pb-containing solders with Pb-free solders have been intensified due to both competitive market pressures and environmental issues. As a result of these activities, a few promising candi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::148d2754397968d1a677e63d0390699c
https://doi.org/10.1109/tepm.2002.801165
https://doi.org/10.1109/tepm.2002.801165