Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Dona Roy"'
Autor:
Dipankar Ghosh, Palash Ghorai, Shrestha Debnath, Dona Roy, Ayan Samanta, Kumar Sagar Maiti, Soumita Sarkar, Debojyoti Roy, Kaushik Sarkar, Rudra Banerjee
Publikováno v:
Visualization Techniques for Climate Change with Machine Learning and Artificial Intelligence ISBN: 9780323997140
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1580e08c4cd1f2e450372871d52165e1
https://doi.org/10.1016/b978-0-323-99714-0.00004-2
https://doi.org/10.1016/b978-0-323-99714-0.00004-2
Autor:
Zeid Abdullah Alothman, Rishabb Anirud, K. V. Suresh Babu, Bhavya Bahl, Arnab Banerjee, Rudra Banerjee, Parminder Kaur Baweja, Bhaskar Behera, Jiban Kumar Behera, Satish Kumar Bhardwaj, Manojit Bhattacharya, Subhomoi Borkotoky, Iti Chauhan, Dipanwita Das, Shrestha Debnath, Lakhvir Kaur Dhaliwal, Rohit Dutt, Dwijendra Nath Dwivedia, Praveen Kumar Gaur, Surya Prakash Gautam, Palash Ghorai, Dipankar Ghosh, Ajmer Singh Grewal, Kumar Guarve, Amit Guleria, Dinesh Kumar Gupta, Mohamed Abdelaty Habila, Shama E. Haque, Dhakshina Priya Rajeswari Ilango, Vijaya Ilango, Adams Ovie Iyiola, Sylvester Chibueze Izah, Mohan Singh Jangra, Sabu Joseph, Amit Joshi, Soniya Joshi, Rohit Kamboj, Shikha Kamboj, Sweta Kamboj, Niladri Bhusan Kar, Mohd Imran Khan, Priyanka Kriplani, Harshbardhan Kumar, Jayendra Kumar, Vinod Kumar, Neeta Kumari, Khushi Maheshwari, Kumar Sagar Maiti, Rajib Maity, Shaheen Manna, Purnima Mehta, Pabitra Mishra, Zeba Mueed, Sayantika Mukherjee, Mohamed Ouladsmane, Jayanti Pal, Soumya Pandey, Ganesh Patilb, Soumya Shraddhya Paul, Pankaj Kumar Rai, Fatemeh Rajabi, Kaveh Rajabi, Neda Rajabi, Glory Richard, Debojyoti Roy, Dona Roy, Amrita Saha, Kartikey Sahil, Nalini Kanta Sahoo, Ayan Samanta, Kaushik Sarkar, Soumita Sarkar, Subharthi Sarkar, Prasoon Kumar Saxena, Richa Saxena, Isha Sharma, Richa Sharma, Satish Kumar Sharma, Alok Pratap Singh, Anubhuti Singh, Karishma Singh, Pardeep Singh, Pranjal Kumar Singh, Shivani Singh, Swati Singh, Karthiyayini Sridharan, Arun Lal Srivastav, Sukanya S, Sunita Verma, Pramod Kumar Yadava, Baturh Yarkwan
Publikováno v:
Visualization Techniques for Climate Change with Machine Learning and Artificial Intelligence ISBN: 9780323997140
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d4ebc0fa08822a7c730506ab986489c
https://doi.org/10.1016/b978-0-323-99714-0.00066-2
https://doi.org/10.1016/b978-0-323-99714-0.00066-2
Publikováno v:
Biomedical Journal of Scientific & Technical Research. 28
In March 2001, World Health Organization (WHO) Prequalification of Medicines Program (PQP) comes in action...
Autor:
Rumel Dey, Dona Roy Chowdhury
When the crystalline structure of the same chemical compound (and atomic formula) exhibits two or more patterns of the repeated unit cells, these crystalline structures are called polymorphs and the phenomena is referred to as polymorphism. Active ph
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::846f3a4eb4f25c54b5f0e90480a2397f
Autor:
Donald R. Songer, Dona Roy
Publikováno v:
Justice System Journal. 31:342-372
There is little doubt that the political attitudes of the justices on the Supreme Court have a significant impact on many outcomes adopted by the Court. But a third or more of Supreme Court decisions are unanimous, and in more than a fifth of their c
Many professionals report using ABC narrative recording to identify the function of problem behavior in children with developmental disabilities, but research has not established whether their analyses yield valid results. Thus, the purpose of this s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fce97e743cc1d97b20462cf398a43322
https://doi.org/10.1016/j.ridd.2013.05.038
https://doi.org/10.1016/j.ridd.2013.05.038
Publikováno v:
MWSCAS
Advancement of VLSI technology helps semiconductor industry to manufacture Through-silicon-via (TSV) based 3D stacked ICs (SICs). During 3D assembly, multiple partial stack tests are necessary. In this paper, we address test architecture optimization
Publikováno v:
Progress in VLSI Design and Test ISBN: 9783642314933
VDAT
VDAT
In the embedded system design Through-silicon-via (TSV) based 3D stacked ICs (SICs) play an important role in semiconductor industry. But testing of these SICs are required during 3D assembly because different die stacking steps may introduce defects
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4af3b5c215202b3c5d4bd83e66f10658
https://doi.org/10.1007/978-3-642-31494-0_8
https://doi.org/10.1007/978-3-642-31494-0_8