Zobrazeno 1 - 10
of 60
pro vyhledávání: '"Don-Son Jiang"'
Autor:
Don-Son Jiang, 江東昇
87
During the application of hypoeutectic Al-Si-Mg alloy, resonant vibration may be encountered to accelerate failure. Therefore, the mechanisms of crack propagation of hypoeutectic Al-Si-Mg alloy under resonant vibration and how to improve its
During the application of hypoeutectic Al-Si-Mg alloy, resonant vibration may be encountered to accelerate failure. Therefore, the mechanisms of crack propagation of hypoeutectic Al-Si-Mg alloy under resonant vibration and how to improve its
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/71073132524807483534
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4592feeca0ebb5c35f34fe4aa69ebeed
https://doi.org/10.23919/icep58572.2023.10129672
https://doi.org/10.23919/icep58572.2023.10129672
Autor:
Ching-Chia Chen, Wen-Yu Teng, Fang Lin Tsai, Jackson Lee, Liang Yih Hung, Don Son Jiang, Yu-Po Wang
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e5d86c27b5b0d76196804ff9da5535b
https://doi.org/10.1109/eptc56328.2022.10013253
https://doi.org/10.1109/eptc56328.2022.10013253
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9695d55a3e9992096b7bccda8abdce2d
https://doi.org/10.23919/icep55381.2022.9795431
https://doi.org/10.23919/icep55381.2022.9795431
Autor:
Jay Li, Wei Jhen Chen, Joe Lin, Mu Hsuan Chan, Tank Lo, Bruce Xu, Liang Yih Hung, Nicholas Kao, Don Son Jiang, Yu-Po Wang
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3a565fe30a41e9ff96846c298c3e6fc
https://doi.org/10.1109/ectc51906.2022.00181
https://doi.org/10.1109/ectc51906.2022.00181
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9705eec4f9dece4fed3e8d0c70380496
https://doi.org/10.1109/eptc53413.2021.9663956
https://doi.org/10.1109/eptc53413.2021.9663956
Autor:
Mu Hsuan Chan, Don Son Jiang, Wei Jhen Chen, C. M. Huang, Chris Chuang, C. Key Chung, Yu Lung Huang
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Moore's law has been slowed down in transistor scaling, but the demands of high computing processing does not cool down and the data rate transmission is growing exponentially in each day. The surge in high data rate causes present DDR4 memories succ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c8f39e5c752e00c79844fb8fdb635f6
https://doi.org/10.1109/ectc32696.2021.00087
https://doi.org/10.1109/ectc32696.2021.00087
Autor:
Yu Po Wang, Andrew Kang, Ying Wei Lu, Don Son Jiang, Pai Yu Cheng, Teny Shih, Po Yuan Su, David Lai
Publikováno v:
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
From the fifth-generation (5G) of system architecture evolution, there are more and more demands which require high data rate communication, low latency, and massive connectivity for network data transmission. For millimeter-wave (mm-wave), communica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e640078e9853823efba88cd9f8515a05
https://doi.org/10.1115/ipack2020-2507
https://doi.org/10.1115/ipack2020-2507
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
In order to enable higher electrical performance for the application of networking, larger FCBGA package was been demanded to meet the electrical target. According to that, the package size usually has been kept to be large around 60mm x 60mm and die
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df5acb4079ce5f60c406e3c8088d14f1
https://doi.org/10.1109/eptc47984.2019.9026653
https://doi.org/10.1109/eptc47984.2019.9026653
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
In order to develop suitable antenna configurations for mmWave band, the selection of the substrate material and the stack-up are also a quite indispensable topic that affects antenna characteristics and the workability. This study focuses on the des
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ab0b577a0fc087b5832296a0ad4b3954
https://doi.org/10.1109/eptc47984.2019.9026649
https://doi.org/10.1109/eptc47984.2019.9026649