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pro vyhledávání: '"Don Syth An"'
Autor:
Sylvia Sutiono, Don Syth An, Jason Hung, Murali Sarangapani, Zhangxi, Frank Lin, Louie Huang, Tok Chee Wei
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
Cu wire bonding has matured much over the years with improvements made not only to the Cu bonding process and optimization methodologies from bonder manufacturers, but also on capillaries and Cu wire itself. It is also part of the roadmap of many ass
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5da332cd78107a415c80d6767b6092c4
https://doi.org/10.1109/eptc.2014.7028261
https://doi.org/10.1109/eptc.2014.7028261
Autor:
Sutiono, Sylvia, Zhangxi, Wei, Tok Chee, An, Don Syth, Sarangapani, Murali, Huang, Louie, Hung, Jason, Lin, Frank
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC); 2014, p99-106, 8p