Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Dominique Langlois-Demers"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:2004-2017
A numerical model is presented for the portion of the flip-chip joining process where liquid-state solder bumps on the substrate and on the device merge (wet) to form full interconnections. An excellent agreement is demonstrated between calculations
Publikováno v:
Volume 10: Micro- and Nano-Systems Engineering and Packaging.
A numerical model is developed for the flip chip reflow process, including many significant aspects of the joining dynamics: thermal expansion of the device and substrate; temperature-dependent substrate warpage; random variations of the solder volum
Publikováno v:
SPIE Proceedings.
Ultrasound damage detection using built-in piezoelectric transducers is a promising technique because it can automatically inspect and interrogate structural damage in hard to access areas. Although numerous efforts have been devoted to the applicati
Publikováno v:
SPIE Proceedings.
In the present paper, a technique called Excitelet is presented for the imaging of damages in thin-walled structures using the correlation of the measured signals with dispersed versions of the excitation signal. Piezoceramic (PZT) actuators are used
Publikováno v:
Health Monitoring of Structural and Biological Systems 2010.
This paper presents the implementation of a chirplet-based matching pursuit technique called excitelet for imaging. High frequency bursts are injected into a structure by a piezoceramic (PZT) actuator and measurement is conducted by a compact array o