Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Dominik Udiljak"'
Autor:
Dominik Udiljak, Reinhard Pufall, Georg M. Reuther, Jamila Boudaden, Peter Ramm, Gabriele Schrag
Publikováno v:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28cfd4a2c0fefbc7493ec68b5baf031c
https://doi.org/10.1109/eurosime54907.2022.9758867
https://doi.org/10.1109/eurosime54907.2022.9758867
Autor:
Michael Goroll, Dominik Udiljak, Reinhard Pufall, Bernhard Wunderle, Georg M. Reuther, Nadine Pflugler
Publikováno v:
Microelectronics Reliability. 99:177-185
Interfacial delamination in semiconductor packages during their lifetime is a reliability risk. For the realisation of a “Design for Reliability” approach, the whole product needs to be studied virtually using Finite Element simulations. Only thi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::137143d79759277f0c10e8599291683a
https://doi.org/10.1016/j.microrel.2019.06.001
https://doi.org/10.1016/j.microrel.2019.06.001
Publikováno v:
ECS Meeting Abstracts. :628-628
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbfa0162537dbe95b914c6e25447c2d5
https://doi.org/10.1149/ma2021-0212628mtgabs
https://doi.org/10.1149/ma2021-0212628mtgabs
Autor:
Bernhard Wunderle, Daniel May, Georg M. Reuther, Nadine Pflugler, Dominik Udiljak, Reinhard Pufall
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Thermo-mechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) and temperature variations remain a major concern for the reliability of semiconductor components. Over the last decade a lot of effort was spent to find solut
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b61c5d7682a1057910fb00511d308135
https://doi.org/10.1109/eurosime.2019.8724551
https://doi.org/10.1109/eurosime.2019.8724551
Autor:
Reinhard Pufall, Rainer Dudek, Georg M. Reuther, Nadine Pflugler, Dominik Udiljak, Michael Goroll
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Thermo-mechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) and temperature changes remain a major concern for the reliability of semiconductor components. Over the last decade a lot of effort was spent to find solution
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b7cc8e9d3865931b64a7617ef901196
https://doi.org/10.1109/eurosime.2018.8369942
https://doi.org/10.1109/eurosime.2018.8369942
Autor:
Dominik Udiljak, Bernhard Wunderle, Nadine Pflugler, Michael Goroll, Reinhard Pufall, Georg M. Reuther
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Interfacial delamination in semiconductor packages during their lifetime is a reliability risk. For the realisation of a “Design for Reliability” approach, the whole product needs to be studied virtually using Finite Element (FE) simulations. Onl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e792721f1812ffe28ac6be7c5762d808
https://doi.org/10.1109/eurosime.2018.8369940
https://doi.org/10.1109/eurosime.2018.8369940
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
Interface delamination in moulded semiconductor packages, being caused by thermo-mechanical load, constitutes a major reliability risk. Delaminated units that are exposed to humidity in automotive environments are prone to moisture absorption via ope
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e4406917d5a5ef182e0fd2237000b1a
https://doi.org/10.23919/empc.2017.8346877
https://doi.org/10.23919/empc.2017.8346877