An ultra-thin bendable Si-monolithic imaging test sensor.

Autor: Dogiamis, G. C., Hafner, J., Mokwa, W., Hosticka, B. J., Grabmaier, A.

Publikováno v: 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators & Microsystems (TRANSDUCERS & EUROSENSORS XXVII); 2013, p964-967, 4p

基于电磁表面的阵列天线及应用概述. (Chinese)

Autor: 周嵩林, 唐隽文, 刘罗颢, 吴优, 刘长昊, 金一飞, 杨帆, 许慎恒, 李懋坤

Publikováno v: Journal on Communication / Tongxin Xuebao; Dec2022, Vol. 43 Issue 12, p13-23, 11p

Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending.

Autor: Palavesam, Nagarajan, Bonfert, Detlef, Hell, Waltraud, Landesberger, Christof, Gieser, Horst, Kutter, Christoph, Bock, Karlheinz

Publikováno v: 2015 IEEE 21st International Symposium for Design & Technology in Electronic Packaging (SIITME); 2015, p367-372, 6p