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pro vyhledávání: '"Do Hwan Chung"'
Autor:
Miji Lee, Do Hwan Chung, Hyo-Young Kim, Mi-Ji Lee, Moonsoo Lee, Jinseok Kim, Hanbyul Kang, Hwasung Rhee, Sangwoo Pae
Publikováno v:
2020 IEEE International Interconnect Technology Conference (IITC).
A novel in-situ electro-thermal TEM method is presented to observe EM Cu interconnects on Co capping and Co liner/TaN barriers. In order to suppress the surface diffusion induced by metallic contamination during sample preparation, a new sampling met
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f46c53e1ad990587ad138974ebc2583b
https://doi.org/10.1109/iitc47697.2020.9515592
https://doi.org/10.1109/iitc47697.2020.9515592
