Zobrazeno 1 - 10
of 37
pro vyhledávání: '"Dirk Seehase"'
Publikováno v:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Induction soldering is a widely used process for the interconnection of construction parts. This technology allows a local heating process without putting the whole module into the oven, which minimizes the thermal load and thus improves the reliabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8d9728e9727c1a846db16f1eda0ede7
https://doi.org/10.23919/empc53418.2021.9584988
https://doi.org/10.23919/empc53418.2021.9584988
Publikováno v:
Periodica Polytechnica Electrical Engineering and Computer Science. 62:172-180
In this work, methods for the endogenous heating of printed circuit boards (PCBs) by means of inductive losses in built-in susceptors are presented. Two basic types of inductive heating were studied, the heating in the transversal field and the heati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9bb188dce463804990b07d17e0a22d4
https://doi.org/10.3311/ppee.13277
https://doi.org/10.3311/ppee.13277
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Heating processes on printed circuit boards (PCBs) are required for various manufacturing steps and also for different tasks throughout the operation of electronic assemblies. This paper aims to give a brief summary of the state of the art for altern
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6f0bfa1049a8b3e85cd7140c53563fb8
https://doi.org/10.23919/empc44848.2019.8951823
https://doi.org/10.23919/empc44848.2019.8951823
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
In the most commonly used soldering process, reflow soldering, it is necessary to heat the system to stably transfer the required energy to the product during the soldering process. 70 percent of the heat energy of a machine is used for self-heating,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3094192959de3a403cb1061a8c37aeb
https://doi.org/10.23919/empc44848.2019.8951814
https://doi.org/10.23919/empc44848.2019.8951814
Publikováno v:
2019 42nd International Spring Seminar on Electronics Technology (ISSE).
To improve process stability, safety, performance and traceability for industrial machinery, the number of sensors has doubled in the last 10 years. Nevertheless, the evaluation of new or additional sensors is a constant task to improve the industria
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d348c88674b53641d164ebd64cc102e4
https://doi.org/10.1109/isse.2019.8810292
https://doi.org/10.1109/isse.2019.8810292
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
This paper will focus on the thermal characterization of resistive layers in conjunction with printed circuit board (PCB) substrate material. The electrical parameters that are required to achieve endogenous heating up to temperatures of $200^{\circ}
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::510f647cb613a808d7c85225cba95759
https://doi.org/10.1109/estc.2018.8546404
https://doi.org/10.1109/estc.2018.8546404
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
For a reflow soldering process the most energy consumption is used to heat up the machine itself. If it would be possible to heat up only the solder pins to the required temperature the energy reduction will be significant. The idea behind such a pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a9b55c27de71e4d08b1a2b621d30e4d
https://doi.org/10.1109/estc.2018.8546505
https://doi.org/10.1109/estc.2018.8546505
Publikováno v:
2018 41st International Spring Seminar on Electronics Technology (ISSE).
For a reflow soldering process, most of the energy consumption is used to heat up the machine itself. If it would be possible to heat up only the solder and pins to the required soldering temperature the energy reduction will be significant. The idea
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b68f1a069a0d232155934544602b461d
https://doi.org/10.1109/isse.2018.8443698
https://doi.org/10.1109/isse.2018.8443698
Publikováno v:
2018 41st International Spring Seminar on Electronics Technology (ISSE).
In this work, methods for the endogenous heating of printed circuit boards (PCBs) by means of inductive losses in built-in susceptors are presented. Taking into account the inductive requirements, various materials are discussed and investigated whic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9c9d16b8a3cace644825c8edb377aee
https://doi.org/10.1109/isse.2018.8443634
https://doi.org/10.1109/isse.2018.8443634
Publikováno v:
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.
The influence of environmental conditions on the resistance development of full-faced heating layers, embedded in the substrate material of printed circuit boards (PCB) is studied in this paper. Therefore suitable test boards are manufactured and sub
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::722900e49e9ecd10ff1e1397c5f676e8
https://doi.org/10.23919/empc.2017.8346909
https://doi.org/10.23919/empc.2017.8346909