Zobrazeno 1 - 10
of 3 049
pro vyhledávání: '"Direct Bonding"'
Publikováno v:
Journal of Materials Research and Technology, Vol 33, Iss , Pp 2530-2537 (2024)
Electrodeposited -oriented nanotwinned Cu (NT-Cu) films consist of micron-scale columnar grains and they are thermally stable up to 400 °C. By adding nanoscale equiaxed Cu grains at the bottom of the NT-Cu films, anisotropic large grain growth could
Externí odkaz:
https://doaj.org/article/d667619980ce45238568fcbc230a23ac
Publikováno v:
Journal of Materials Research and Technology, Vol 32, Iss , Pp 3490-3499 (2024)
Cu–Cu joints with various interfacial microstructures were fabricated, by applying different annealing conditions to the joints to trigger different amounts of recrystallization and grain growth at the bonding interfaces. Three distinct interfaces
Externí odkaz:
https://doaj.org/article/49506bd438a449688b742a09bb62a880
Autor:
Yun-Fong Lee, Yu-Chen Huang, Jui-Sheng Chang, Ting-Yi Cheng, Po-Yu Chen, Wei-Chieh Huang, Mei-Hsin Lo, Kuan-Lin Fu, Tse-Lin Lai, Po-Kai Chang, Zhong-Yen Yu, Cheng-Yi Liu
Publikováno v:
Royal Society Open Science, Vol 11, Iss 9 (2024)
Fine-grain copper (Cu) films (grain size: 100.36 nm) with a near-atomic-scale surface (0.39 nm) were electroplated. Without advanced post-surface treatment, Cu–Cu direct bonding can be achieved with present-day fine-grain Cu films at 130℃ in air
Externí odkaz:
https://doaj.org/article/d8a16e4e273341e99b79d76575454a59
Publikováno v:
In Journal of Materials Research and Technology November-December 2024 33:2530-2537
Publikováno v:
Journal of Materials Research and Technology, Vol 27, Iss , Pp 7957-7963 (2023)
A large lattice mismatch between Ag and Cu commonly results in incoherently polycrystalline deposited features. It is very challenging to epitaxially deposit an Ag film on Cu. In this study, an epitaxial Ag film was electroless-deposited on nanotwinn
Externí odkaz:
https://doaj.org/article/09af45e55da540f4aa594bb19ad9e96e
Autor:
Tsan-Feng Lu, Yu-Ting Yen, Pei-Wen Wang, Yuan-Fu Cheng, Cheng-Hsiang Chen, YewChung Sermon Wu
Publikováno v:
Nanomaterials, Vol 14, Iss 10, p 861 (2024)
For decades, Moore’s Law has been approaching its limits, posing a huge challenge for further downsizing to nanometer dimensions. A promising avenue to replace Moore’s Law lies in three-dimensional integrated circuits, where Cu–Cu bonding plays
Externí odkaz:
https://doaj.org/article/6fefe87a6b434b3aa4f5930bc3acd702
Publikováno v:
Nanomaterials, Vol 14, Iss 9, p 771 (2024)
For decades, Moore’s Law has neared its limits, posing significant challenges to further scaling it down. A promising avenue for extending Moore’s Law lies in three-dimensional integrated circuits (3D ICs), wherein multiple interconnected device
Externí odkaz:
https://doaj.org/article/12b57a9878c44f7ebdd6d9c7538c946e
Publikováno v:
Jixie qiangdu, Pp 499-503 (2023)
In order to solve the problem of low connection strength between elastic skin and honeycomb sandwich of composite flexible skin for variant aircraft, a “two-step bonding” connection scheme is proposed. Firstly, the polyurethane fiber cloth and ho
Externí odkaz:
https://doaj.org/article/d5cfb3dd4e3841ac965b6a51d71621b7
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