Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Dinos Huang"'
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
In recent years, the evolution of semiconductor packages is driven by the consumer demands of Internet of Things (IoT), mobile phones, wearable devices, and tablets. Manufacturing has evolved from wafer-level chip-scale packaging (WLCSP) to fan-out w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8ae6df34fbeb312d2af3d5d01f0af0e
https://doi.org/10.1109/ectc.2019.00262
https://doi.org/10.1109/ectc.2019.00262
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
Portable electronics have become ubiquitous tools for everyday living, with increasing semiconductor density required for the expanding functionality expected in each generation by consumers. This requires that the semiconductors in these devices hav
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::74c171185d1703c59ce4208dd10424f5
https://doi.org/10.1109/estc.2012.6542154
https://doi.org/10.1109/estc.2012.6542154