Výsledky vyhledávání - "Ding Shaofeng"

Fabrication and Characterization of ISC embedded Interposer for High Performance Interconnection

Autor: Won Ji Park, Jae Hee Oh, Ji Hyung Kim, Seong Wook Moon, Jeong Hoon Ahn, Ding Shaofeng, Jung Ho Park, Won Hyoung Lee, Min Guk Kang, Choi Yun Ki, Seung Ki Nam, Je Gwan Hwang, Jong Mil Youn

Publikováno v: 2021 IEEE International Interconnect Technology Conference (IITC).

Interposer to interconnect between the electronic components has been developed for the last few decades because it can improve the system performance effectively, compared to the system with intra-chip wiring. In this paper, the integrated stack cap

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::342c132f1ebe9f90373a841699094d8f
https://doi.org/10.1109/iitc51362.2021.9537342

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Integration of an advanced 3D TSV with the 7nm EUV logic process

Autor: Joon Nyung Lee, Yuri Y. Masuoka, Jae Hee Oh, Jihyung Kim, Dongju Seo, Ding Shaofeng, Jeong Hoon Ahn, Won Ji Park, Sang-Deok Kwon, Haeri Yoo, Minguk Kang, Choi Yun Ki

Publikováno v: 2020 IEEE International Interconnect Technology Conference (IITC).

The integration of a high aspect ratio Through Silicon Via (TSV) process with the EUV 7nm logic process was developed for the first time. The TSV and MOL to BEOL interface process was developed and the BEOL Via on TSV and MOL structure was evaluated.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::eece62ccc4f464e2f0bc8f45bf92ea4b
https://doi.org/10.1109/iitc47697.2020.9515673

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