Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Dinesh P.R. Thanu"'
Autor:
Daksh Agrawal, Aravindha Antoniswamy, Nadia F. Awad, Sami B. Awad, Rajesh Balachandran, Nikhil Dole, Michael L. Free, Manish Keswani, Rajiv Kohli, Jatinder Kumar, Malcolm McLaughlin, Michael Moussourakis, Jin-Goo Park, Jeff Phillips, Maneesh Kumar Poddar, Endu Sekhar Srinadhu, Vikhram V. Swaminathan, Dinesh P.R. Thanu, Nagendra Prasad Yerriboina, Mingrui Zhao, Yakun Zhu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::711d59e1cc529941e9cf0b7a8d8768df
https://doi.org/10.1016/b978-0-12-822216-4.00009-4
https://doi.org/10.1016/b978-0-12-822216-4.00009-4
Autor:
Dinesh P.R. Thanu, Aravindha Antoniswamy, Vikhram V. Swaminathan, Endu Sekhar Srinadhu, Nikhil Dole, Mingrui Zhao, Rajesh Balachandran, Daksh Agrawal, Jatinder Kumar, Manish Keswani
Publikováno v:
Surfactants in Precision Cleaning ISBN: 9780128222164
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::845e9dc8bb709b7200fab61dc9a15558
https://doi.org/10.1016/b978-0-12-822216-4.00002-1
https://doi.org/10.1016/b978-0-12-822216-4.00002-1
Autor:
E. S. Srinadhu, Mingrui Zhao, Jatinder Kumar, Manish Keswani, Dinesh P.R. Thanu, Radhey Shyam
Publikováno v:
Reviews of Adhesion and Adhesives. 7:169-194
Polymers are widely used in different types of industries ranging from microelectronics, medical to space applications. However, polymer materials are seldom used in their pristine state and are in need of selective surface treatment to induce a spec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7a468db584c620a6addf1dfe9a7c6767
https://doi.org/10.7569/raa.2019.097307
https://doi.org/10.7569/raa.2019.097307
Publikováno v:
Progress in Adhesion and Adhesives
High performance and diverse power computing needs in desktop, server, communication, automotive, and artificial intelligence microelectronic sectors demand microprocessors with different form factors and intricate package designs. For such complex p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::340db70c3cdb67c5f841f476b84ce66b
https://doi.org/10.7569/raa.2018.097304
https://doi.org/10.7569/raa.2018.097304
With the advancement in technology, contaminant removal has become an important factor in many industries. This includes semiconductor, medical, marine biology, food processing, waste water purification, solar panel cleaning, textile industry, coal w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4bd3dea48734dd57e4441f962c8779d7
https://doi.org/10.1016/b978-0-12-815577-6.00001-3
https://doi.org/10.1016/b978-0-12-815577-6.00001-3
Surface treatment is necessary in a host of industries to attain a defect-free surface. In medical and semiconductor fields, for example, clean surfaces are essential to provide good adhesion across multiple interfaces. Conventional treatment methods
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1432a3e8829f0fa353b86e0c49023d6
https://doi.org/10.1016/b978-0-12-815577-6.00008-6
https://doi.org/10.1016/b978-0-12-815577-6.00008-6
Autor:
Nikhil V. Dole, Kuniaki Gotoh, Zhenxing Han, Sandeep Kalelkar, Alhaji M. Kamara, Manish Keswani, Rajiv Kohli, Brad Lyon, Sundar Marimuthu, Jay Postlewaite, Hüsein Kürşad Sezer, Robert Sherman, Endu Sekhar Srinadhu, Dinesh P.R. Thanu, Mingrui Zhao
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::31805364544f0c9e7d0dc1bbd901edd5
https://doi.org/10.1016/b978-0-12-815577-6.09991-6
https://doi.org/10.1016/b978-0-12-815577-6.09991-6
Publikováno v:
ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Nowadays microelectronic packaging has become a billion dollar business. Due to the increased material and production costs per package, manufacturing yield loss in this state-of-art business is expected to be at a bare minimum which is tough to pers
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12e7fa6b7e78d241f43d8062edc9ecc1
https://doi.org/10.1115/ipack2018-8254
https://doi.org/10.1115/ipack2018-8254
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 25:516-522
Feasibility of dissolution of post-etch residues (PERs) formed on copper in formulations containing a mixture of urea (U)-choline chloride (CC) deep eutectic solvent (DES) and water (W) has been investigated. PER films were formed on copper surface b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8cb9f47fc29bf42579b397055e5fd64
https://doi.org/10.1109/tsm.2012.2190998
https://doi.org/10.1109/tsm.2012.2190998
Publikováno v:
ECS Transactions. 25:109-116
Effectiveness of dilute HF based formulations in selectively removing copper oxide (CuOX) films with respect to copper and dielectric films has been investigated. Key solution variables studied include HF concentration, dissolved oxygen level and pH.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::15e524600a628db5d34a22dd8af71885
https://doi.org/10.1149/1.3202642
https://doi.org/10.1149/1.3202642