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pro vyhledávání: '"Dijsseldonk, A. van"'
Autor:
Dijsseldonk, R.B. van
Publikováno v:
Donders Series ; 502. s.l. : s.n.
Donders Series ; 502
Donders Series ; 502
Contains fulltext : 232866.pdf (Publisher’s version ) (Open Access) Radboud University, 07 mei 2021 Promotor : Geurts, A.C.H. Co-promotores : Keijsers, N.L.W., Nes, I.J.W. van 214 p.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::45948d3ecd9816b0c7b23d4ac72311a8
https://hdl.handle.net/2066/232866
https://hdl.handle.net/2066/232866
Autor:
Kuiper, S., Fritz, E.C., Crowcombe, W.E., Liebig, T., Kramer, G.F.I., Witvoet, G., Duivenvoorde, T., Overtoom, A.J., Rijnbeek, R.A., Zwet, E.J. van, Dijsseldonk, A. van, Boef, A. den, Beems, M., Levasier, L.
Publikováno v:
Sanchez, M.I.Ukraintsev, V.A., 30th Conference on Metrology, Inspection, and Process Control for Microlithography, 22-25 February 2016, 9778
Nowadays most overlay metrology tools assess the overlay performance based on marker features which are deposited next to the functional device features within each layer of the semiconductor device. However, correct overlay of the relatively coarse
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::11a6679a4969054dbfbc01c4cb269935
http://resolver.tudelft.nl/uuid:37309d0e-df8b-4a85-bc03-d598d1d498a5
http://resolver.tudelft.nl/uuid:37309d0e-df8b-4a85-bc03-d598d1d498a5